onsemi DAP222U
The DAP222 device is housed in the SC-75/SOT-416 package which is designed for low power surface mount applications, where board space is at a premium. The DAP202U device is housed in the SC-70/SOT-323 package.FEATURES
● Fast trr● Low CD
● NSV Prefix for Automotive and Other
APPLICATIONS
Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPA Capable● These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant
MAXIMUM RATINGS
(TA = 25 C) Rating Symbol Value Unit Reverse Voltage Peak Reverse Voltage Forward Current Peak Forward Current Peak Forward Surge Current VR 80 Vdc VRM 80 Vdc IF 100 mAdc IFM 300 mAdc IFSM(1) 2.0 Adc THERMAL CHARACTERISTICS Rating Symbol Max Unit Power Dissipation PD 150 mW Junction Temperature TJ 150 C Storage Temperature Tstg −55 ~ + 150 C Stresses exceeding those listed in theMAXIMUM RATINGS
table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. DATA SHEET ANODE 3 3 1 2 1 2 CATHODE MARKING DIAGRAMS SC-70 CASE 419 NB M G G 1 3 2 1 SC-75 CASE 463 STYLE 4 P9 M G G 1 NB, P9 = Device Codes M = Date Code* G = Pb-Free Package (Note: Microdot may be in either location) * Date Code orientation and/or orientation may vary depending upon manufacturing location.