MBR2545CTG Datasheet PDF

onsemi MBR2545CTG

The MBR2535CTG/45CTG series uses the Schottky Barrier principle with a platinum barrier metal. These state−of−the−art devices have the following features: Features Guardring for Stress Protection Low Forward Voltage 175 C Operating Junction Temperature These are Pb−Free Devices* Mechanical Characteristics Case: Epoxy, Molded Epoxy Meets UL 94 V−0 @ 0.125 in Weight: 1.9 Grams (Approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead Temperature for Soldering Purposes: 260 C Max. for 10 Seconds *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.