onsemi NCP81081
The NCP81081 integrates a MOSFET driver , high−side MOSFET and low −side MOSFET into a 6 mm x 6 mm 40 −pin QFN package. The driver and MOSFET s have been optimized for high−current DC−DC buck power conversion applications. The NCP81081 integrated solution greatly reduces package parasitics and board space compared to a discrete component solution.- Min Voltage : 4.5V
- Max Voltage : 5.5V
- Max Operating Temp : 100°C
- Min Operating Temp : -10°C
Source:
Octopart
FEATURES
MARKING DIAGRAM 1●
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● Capable of Switching Frequencies Up to 1 MHz Capable of Output Currents Up to 35 A PWM Input Capable of 3.3 V and 5 V Internal Bootstrap Diode Zero Current Detection Undervoltage Lockout Internal Thermal Warning / Thermal Shutdown These are Pb−Free Devices 5V 12−20 V 1 40 QFN40 MN SUFFIX CASE 485AZ A WL YY WW G NCP81081 AWLYYWWG = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package 5V Thermal Warning THWN VCIN VIN BOOT PHASE VSWH PWM CGND PGND Vout ORDERING INFORMATION Device NCP81081MNR2G NCP81081MNTWG Package Shipping† QFN40 2500/Tape & Reel (Pb−Free) QFN40 2500/Tape & Reel (Pb−Free) ZCD Enable Output Disable PWM ZCD_EN# DISB# †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Figure 1. Application Schematic © Semiconductor Components Industries, LLC, 2012 March, 2012 − Rev. 1 1 Publication Order Number: NCP81081/D NCP81081 BOOT GH VIN VCIN PWM Logic ZCD_EN# Anti−Cross Conduction VCIN PHASE VSWH PGND DISB# UVLO THWN/THDN THWN GL Figure 2.