PZT751 Datasheet PDF

FEATURES

● High Current
● The SOT−223 Package can be soldered using wave or reflow.
● SOT−223 Package Ensures Level Mounting, Resulting in Improved Thermal Conduction, and Allows Visual Inspection of Soldered Joints. The Formed Leads Absorb Thermal Stress During Soldering, Eliminating the Possibility of Damage to the Die
● NPN Complement is PZT651T1G
● S Prefix for Automotive and Other

APPLICATIONS

Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
● These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant*

MAXIMUM RATINGS

(TC = 25°C unless otherwise noted) Rating Symbol Value Unit Collector−Emitter Voltage Collector−Base Voltage Emitter−Base Voltage Collector Current Total Power Dissipation @ TA = 25°C (Note 1) Derate above 25°C VCEO VCBO VEBO IC PD −60 Vdc −80 Vdc −5.0 Vdc −2.0 Adc W 0.8 mW/°C 6.4 Storage Temperature Range Tstg − 65 to 150 °C Junction Temperature TJ 150 °C Stresses exceeding those listed in the

MAXIMUM RATINGS

table may damage the device.