onsemi QRE1113
Miniature Reflective Object Sensor
FEATURES
● Phototransistor Output● No Contact Surface Sensing
● Miniature Package
● Lead Form Style: Gull Wing
● Two Leadform Options: Through Hole (QRE1113) SMT Gull Wing (QRE1113GR & QRE1114GR)
● Two Packaging Options: Tube (QRE1113) Tape and Reel (QRE1113GR & QRE1114GR)
MAXIMUM RATINGS
(TA = 25C unless otherwise noted) Symbol Parameter Value Unit TOPR TSTG TSOL−I Operating Temperature Storage Temperature Soldering Temperature (Iron) (Notes 2, 3, 4) −40 to +85 C −40 to +90 C 240 for 5 s C TSOL−F Soldering Temperature (Flow) (Notes 3, 4) 260 for 10 s C EMITTER IF VR IFP PD SENSOR Continuous Forward Current Reverse Voltage Peak Forward Current (Note 5) Power Dissipation (Note 1) 50 mA 5 V 1 A 75 mW VCEO Collector-Emitter Voltage 30 V VECO Emitter-Collector Voltage 5 V IC Collector Current 20 mA PD Power Dissipation (Note 1) 50 mW Stresses exceeding those listed in theMAXIMUM RATINGS
table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.