onsemi SZESD9B
ESD Protection Diode
FEATURES
● Low Capacitance 15 pF● Low Clamping Voltage
● Small Body Outline Dimensions: 0.039● x 0.024● (1.0 x 0.60 mm)
● Low Body Height: 0.016● (0.4 mm)
● Stand−off Voltage: 3.3 V, 5 V
● Low Leakage
● Response Time is < 1 ns
● IEC61000−4−2 Level 4 ESD Protection
● AEC−Q101 Qualified and PPAP Capable
● SZ Prefix for Automotive and Other
APPLICATIONS
Requiring Unique Site and Control Change Requirements● These are Pb−Free Devices Mechanical Characteristics CASE: Void-free, transfer-molded, thermosetting plastic Epoxy Meets UL 94 V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: 260C Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating IEC 61000−4−2 (ESD) Symbol Value Unit Contact Air 18 kV 18 IEC 61000−4−4 (EFT) Total Power Dissipation on FR−5 Board (Note 1) @ TA = 25C Thermal Resistance, Junction−to−Ambient Junction and Storage Temperature Range Lead Solder Temperature − Maximum (10 Second Duration) PD RqJA TJ, Tstg TL 40 A 300 mW 400 C/W −55 to +150 C 260 C Stresses exceeding those listed in theMAXIMUM RATINGS
table may damage the device.