1N5261B Datasheet PDF

The 1N5261B is a Zener Diodes.

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Part Number1N5261B Datasheet
Manufactureronsemi
Overview Zener Diodes 1N5221B - 1N5252B DATA SHEET ABSOLUTE MAXIMUM RATINGS (Note 1) Values are at TA = 25°C unless otherwise noted. Symbol Parameter Value Unit PD Power Dissipation Der. Industries, LLC, 2018 1 November, 2023
* Rev. 5 Publication Order Number: 1N5221B/D 1N5221B
* 1N5252B ELECTRICAL CHARACTERISTICS Values are at TA = 25°C unless otherwise noted. VZ (V) @ IZ (Note 2) Device Min. Typ. Max. ZZ (W) @ IZ (mA) ZZK (W) @ IZK (mA) 1N5221B 2.280 2.4 2.52 30 .
Part Number1N5261B Datasheet
DescriptionVoltage regulator diodes
ManufacturerNXP Semiconductors
Overview Low-power voltage regulator diodes in hermetically sealed leaded glass SOD27 (DO-35) packages. The series consists of 43 types with nominal working voltages from 3.0 to 75 V. k a MAM239 APPLICATION.
* Total power dissipation: max. 500 mW
* Tolerance series: ±5%
* Working voltage range: nom. 3.0 to 75 V
* Non-repetitive peak reverse power dissipation: max. 40 W. handbook, halfpage 1N5225B to 1N5267B DESCRIPTION Low-power voltage regulator diodes in hermetically sealed leaded glass SOD27 (DO-35.
Part Number1N5261B Datasheet
Description500mW 5% DO-35 ZENER DIODE
ManufacturerRectron
Overview RECTRON SEMICONDUCTOR TECHNICAL SPECIFICATION 1N5223B THRU 1N5261B 500mW 5% DO-35 ZENER DIODE Absolute Maximun Ratings (Ta=25oC) Items Power Dissipation Power Derating (above 75 oC) Forward Voltage . E MAX ZENER IMPEDANCE Izt = 0.25mA MAXIMUM REVERSE CURRENT TEMP. COEFF. dvz Rz (ohms) 1300 1400 1600 1600 1700 1900 2000 1900 1600 1600 1600 1000 750 VR (V) 1.0 1.0 1.0 1.0 1.0 1.0 1.0 2.0 2.0 3.0 3.5 4.0 5.6 IR (uA) 75 75 50 25 15 10 5 5 5 5 5 5 3 (%/ oC) -0.080 -0.080 -0.075 -0.070 -0.065 -0.060 .
Part Number1N5261B Datasheet
DescriptionSILICON ZENER DIODES
ManufacturerPanJit Semiconductor
Overview 1N5221B~1N5266B SILICON ZENER DIODES VOLTAGE 2.4 to 68 Volt POWER 500 mWatt FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead f.
* Planar Die construction
* 500mW Power Dissipation
* Ideally Suited for Automated Assembly Processes
* Lead free in compliance with EU RoHS 2011/65/EU directive MECHANICAL DATA
* Case: Molded Glass DO-35
* Terminals: Solderable per MIL-STD-750, Method 2026
* Polarity: See Diagram Below
* Approx. W.