1SMA4758 Datasheet and Specifications PDF

The 1SMA4758 is a SMD Zener Diode.

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Part Number1SMA4758 Datasheet
ManufacturerFEC Semiconductor
Overview F.E.C. Semiconductor IV. Zener Diode SMD Zener Diode (1.0 Watt) 1SMA4728~1SMA200A FEATURES For surface mounted applications in order to optimize board space. Built-in strain relief. Glass passivated j. For surface mounted applications in order to optimize board space. Built-in strain relief. Glass passivated junction. Low inductance. Typical IR less than 5.0µA above 11V. High temperature soldering guaranteed: 260 /10 seconds at terminals. Plastic package has Underwriters Laboratory Flammability Cl.
Part Number1SMA4758 Datasheet
DescriptionZener Diodes
ManufacturerKexin Semiconductor
Overview SMD Type ■ Features Zener Diodes 1SMA4728~4764 Diodes 2.126 1.397 2 4.597 3.988 5.668 4.925 Unit: mm 4.32 4.12 2.896 2.22 1 2.489 2.02 2.438 1.981 2.75 2.55 5.87 5.67 Recommended Land Pattern . Zener Diodes 1SMA4728~4764 Diodes 2.126 1.397 2 4.597 3.988 5.668 4.925 Unit: mm 4.32 4.12 2.896 2.22 1 2.489 2.02 2.438 1.981 2.75 2.55 5.87 5.67 Recommended Land Pattern 1.524 0.762 0.203 0.051 0.305 0.152
* Absolute Maximum Ratings Ta = 25℃ Parameter Peak forward surge current Power .
Part Number1SMA4758 Datasheet
Description1W WIDE ZENER DIODE
ManufacturerAiT Semiconductor
Overview The 1SMA4728 ~1SMA4777 are available in SMA Package. ORDERING INFORMATION Package Type Part Number 1SMA4728 1SMA4753 1SMA4729 1SMA4754 1SMA4730 1SMA4755 1SMA4731 1SMA4756 1SMA4732 1SMA475.
* Total Power Dissipation: Max. 1W.
* Wide Zener Reverse Voltage Range 3.3V to 330V
* Small Plastic Package Suitable for Surface Mounted Design. MECHANICAL DATA
* Case: SMA
* Terminals: Solderable per MIL-STD-750, Method 2026
* Approx. Weight: 55mg / 0.002oz PIN DESCRIPTION SMA Package PIN# 1 2 D.
Part Number1SMA4758 Datasheet
Description1.0Watts Surface Mount Silicon Zener Diode
ManufacturerLGE
Overview 1SMA4737-1SMA200Z 1.0Watts Surface Mount Silicon Zener Diode SMA/DO-214AC Features For surface mounted applications in order to optimize board space Low profile package Built-in strain relief Glass . For surface mounted applications in order to optimize board space Low profile package Built-in strain relief Glass passivated junction Low inductance Typical IR less than 5.0uA above 7.5V High temperature soldering guaranteed: 260oC / 10 seconds at terminals Plastic package has Underwriters Laborato.

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