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BCP56 Datasheet

The BCP56 is a MEDIUM POWER AMPLIFIER. Download the datasheet PDF and view key features and specifications below.

Part NumberBCP56
ManufacturerSTMicroelectronics
Overview BCP55/56 MEDIUM POWER AMPLIFIER ADVANCE DATA s s s s SILICON EPITAXIAL PLANAR NPN TRANSISTORS MINIATURE PLASTIC PACKAGE FOR APPLICATION IN SURFACE MOUNTING CIRCUITS GENERAL PURPOSE MAINLY INTENDED. ction-Ambient Thermal Resistance Junction-Collecor Tab Max Max 62.5 8 o o C/W C/W
* Mounted on a ceramic substrate area = 30 x 35 x 0.7 mm ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified) Symbol I CBO V (BR)CBO Parameter Collector Cut-off Current (I E = 0) Collector-Base Brea.
Part NumberBCP56
DescriptionNPN General Purpose Amplifier
ManufacturerFairchild Semiconductor
Overview SOT-223 parts are shipped in tape. The carrier tape is made from a dissipative (carbon filled) polycarbonate resin. The cover tape is a multilayer film (Heat Activated Adhesive in nature) primarily c. ction to Ambient 1 8 125 W mW/°C °C/W Units *Device mounted on FR-4 PCB 36 mm X 18 mm X 1.5 mm; mounting pad for the collector lead min. 6 cm2. ©1998 Fairchild Semiconductor Corporation Pr3947_REV A BCP56 NPN General Purpose Amplifier (continued) Electrical Characteristics Symbol Parameter TA.
Part NumberBCP56
DescriptionNPN Transistor
Manufactureronsemi
Overview DATA SHEET NPN Silicon Epitaxial Transistor BCP56 Series These NPN Silicon Epitaxial transistors are designed for use in audio amplifier applications. The device is housed in the SOT−.
* High Current: 1.0 A
* The SOT−223 package can be soldered using wave or reflow. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die
* Available in 12 mm Tape and Reel Use BCP56T1G to Order the 7 inch/1000 Unit Reel Use BCP56T3G to Order the 13 .
Part NumberBCP56
DescriptionNPN medium power transistors
ManufacturerNXP Semiconductors
Overview NPN medium power transistor series in Surface-Mounted Device (SMD) plastic packages. Table 1. Product overview Type number[1] Package NXP BCP56 SOT223 BCX56 SOT89 BC56PA SOT1061 JEITA SC-73. and benefits  High current  Three current gain selections  High power dissipation capability  Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061)  Leadless very small SMD plastic package with medium power capability (SOT1061)  AEC-Q101 qualified 1.3 Application.

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