BY8006 Datasheet
BY8006 Datasheet (NXP Semiconductors)
NXP Semiconductors
Rugged glass package, using a high temperature alloyed construction. This package is hermetically sealed and fatigue free as coefficients of a APPLICATIONS • For colour television and monitors up to.
* Glass passivated
* High maximum operating temperature
* Low leakage current
* Excellent stability
* Guaranteed avalanche energy absorption capability
* Soft-recovery switching characteristics
* Compact construction.
k handbook, halfpage
BY8000 series
expansion of all used parts are matched. The p.
BY8006 Datasheet (EIC Semiconductor)
EIC Semiconductor
TH97/2478 TH09/2479 IATF 0113686 SGS TH07/1033 BY8006 PRV : 8000 Volts IF(AV) : 10 mA FEATURES : * High current capability * High surge current capability * High reliability * Low .
: * High current capability * High surge current capability * High reliability * Low reverse current * Low forward voltage drop * Pb / RoHS Free MECHANICAL DATA : * Case : DO-41 Molded plastic * Epoxy : UL94V-O rate flame retardant * Lead : Axial lead solderable per MIL-STD-202, Method 208 guarantee.