| Part Number | BYM36D Datasheet |
|---|---|
| Manufacturer | NXP Semiconductors |
| Overview |
BYM36 series
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
Rugged glass SOD64 package, using a high temperature alloyed constructio.
* Glass passivated * High maximum operating temperature * Low leakage current * Excellent stability * Guaranteed avalanche energy absorption capability * Available in ammo-pack * Also available with preformed leads for easy insertion. DESCRIPTION BYM36 series This package is hermetically sealed and. |