| Part Number | BZG03-C91 Datasheet |
|---|---|
| Manufacturer | NXP Semiconductors |
| Overview |
DO-214AC surface mountable package with glass passivated chip.
BZG03 series
The well-defined void-free case is of a transfer-moulded thermo-setting plastic.
handbook, 4 columns
Fig.1 Simplified out.
* Glass passivatedb * High maximum operating temperature * Low leakage current * Excellent stability * UL 94V-O classified plastic package * Zener working voltage range: 10 to 270 V for 35 types * Supplied in 12 mm embossed tape. DESCRIPTION DO-214AC surface mountable package with glass passivated c. |