BZT52C15S Datasheet
BZT52C15S Datasheet (Dc Components)
Dc Components
DC COMPONENTS CO., LTD. BZT52C2V4S THRU R RECTIFIER SPECIALISTS BZT52C39S TECHNICAL SPECIFICATIONS OF SURFACE MOUNT ZENER DIODES FEATURES * Planar Die construction * Zener Voltages from 2.4V - 39V.
* Planar Die construction * Zener Voltages from 2.4V - 39V * 410mW Power Dissipation * Ideally Suited for Automated Assembly Processes SOD-323 MECHANICAL DATA * Case: Molded Plastic * Terminals:Solder plated, solderable per MIL-STD-202, Method 208 * Polarity: See Diagram Below * Mounting position:.
BZT52C15S Datasheet (Taiwan Semiconductor)
Taiwan Semiconductor
BZT52C2V4S - BZT52C75S Taiwan Semiconductor 200mW, 5% Tolerance SMD Zener Diode FEATURES ● Wide Zener voltage range selection: 2.4V to 75V ● VZ tolerance selection of ± 5% ● Moisture sensitivity lev.
* Wide Zener voltage range selection: 2.4V to 75V
* VZ tolerance selection of ± 5%
* Moisture sensitivity level: level 1, per J-STD-020
* RoHS Compliant
APPLICATIONS
* Low voltage stabilizers or voltage references
* Adapters
* On-board DC/DC converter
KEY PARAMETERS
PARAMETER VALUE UNIT
VZ
2.4 -.
BZT52C15S Datasheet (Continental Device India)
Continental Device India
Maximum Forward Voltage Drop @ IF= 10mA Power Dissipation @ 25ºC Peak Forward Surge Current, 8.3ms Single Half Sine-WaveSuperimposed on Rated Load Operating Junction and Storage Temperature Range * M.
.80 18.90 21.00 23.10 25.20 28.35 31.50 34.65 37.80 40.95 VF @ 10mA <0.9V Reverse Leakage Zener Impedance Current ZZK @ IZK ZZT @ IZT IR @ VR (mA) (mA) (V) (Ω ) (Ω ) (µ A) max max max 95 5.0 500 1.0 5.0 1.0 78 5.0 500 1.0 5.0 2.0 60 5.0 480 1.0 0.1 0.8 40 5.0 400 1.0 0.1 1.0 10 5.0 200 1.0 0.1 2.0 8.
BZT52C15S Datasheet (Kexin Semiconductor)
Kexin Semiconductor
SMD Type Surface Mount Zener Diodes BZT52C2V0S - BZT52C39S Diodes Features Planar Die Construction Ultra-Small Surface Mount Package Ideally Suited for Automated Assembly Processes Absolute Maximum.
Planar Die Construction Ultra-Small Surface Mount Package Ideally Suited for Automated Assembly Processes Absolute Maximum Ratings (Ta = 25 ) Parameter Power dissipation Thermal Resistance, Junction to Ambient Air Forward Voltage @ IF = 10mA R Symbol P JA Rating 200 625 0.9 150 -65 to +150 Unit m.