DBF258 Datasheet
DBF258 Datasheet (Chip Integration Technology)
Chip Integration Technology
Chip Integration Technology Corporation DBF251 THRU DBF2510 2.5A Bridge Rectifiers .015 (0.4) .012 (0.3) .055 (1.4) .031 (0.8) ■ Features • Glass passivated die construction • Low leakage • High c.
* Glass passivated die construction
* Low leakage
* High current capability
* Ideal for printed circuit board
* Design for surface mount application
* Suffix “G” indicates Halogen free parts, ex DBF251G
* Plastic Material-UL Flammability 94V-0
* Mechanical data
* Case : DBF,Molded plastic.
* Termina.
DBF258 Datasheet (Eris Technology)
Eris Technology
DBF25xx Series SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER DBF Features ‧Glass Passivated Die Construction ‧Low leakage ‧Ideal for printed circuit board ‧Surge overload rating-90A peak ‧Designed.
‧Glass Passivated Die Construction ‧Low leakage ‧Ideal for printed circuit board ‧Surge overload rating-90A peak ‧Designed for Surface Mount Application ‧Plastic Material-UL Flammability 94V-0 Mechanical ‧Case: DBF, molded plastic ‧Terminals:Plated Leads Solderable per MILSTD-202,Method208 ‧Polarit.