DF1506M Datasheet and Specifications PDF

The DF1506M is a SURFACE MOUNT BRIDGE RECTIFIERS.

DF1506M Datasheet

DF1506M Datasheet (EIC Semiconductor)

EIC Semiconductor

DF1506M Datasheet Preview

TH97/2478 TH09/2479 IATF 0113686 SGS TH07/1033 DF15005M - DF1510M MINI-BRIDGE RECTIFIERS PRV : 50 - 1000 Volts Io : 1.5 Ampere DFM 0.255(6.5) 0.245(6.2) ~~ FEATURES : * High c.

: * High current capability * High surge current capability * High reliability * Low reverse current * Low forward voltage drop * Ideal for printed circuit board * Pb / RoHS Free MECHANICAL DATA : * Case : Molded plastic * Epoxy : UL94V-0 rate flame retardant * Terminals : Leads solderable per MIL-S.

DF1506M Datasheet (Vishay)

Vishay

DF1506M Datasheet Preview

DF15005M–DF1510M Vishay Lite–On Power Semiconductor 1.5A Glass Passivated Bridge Rectifier Features D Glass passivated die construction D Diffused junction D Low forward voltage drop, high current ca.

D Glass passivated die construction D Diffused junction D Low forward voltage drop, high current capability D Surge overload rating to 50A peak D Designed for printed circuit board applications D Plastic material
* UL Recognition flammability classification 94V
*0 D This series is UL listed under rec.

DF1506M Datasheet (ME)

ME

DF1506M Datasheet Preview

SINGLE PHASE GLASS PASSIVATED BRIDGE RECTIFIER DF15005M THRU DF1510M FEATURES • • • • VOLTAGE RANGE CURRENT 50 to 1000 Volts 1.5 Ampere high forward surge current capability Glass passivated chip .


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* VOLTAGE RANGE CURRENT 50 to 1000 Volts 1.5 Ampere high forward surge current capability Glass passivated chip junction High case dielectric strength High temperature soldering guaranteed: 260OC / 10 seconds MECHANICAL DATA
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* Case: Transfer molded plastic Terminal: Lead solderabl.

DF1506M Datasheet (Taitron Components)

Taitron Components

DF1506M Datasheet Preview

1.5A Glass Passivated Bridge Rectifier DF15005M – DF1514M 1.5A Glass Passivated Bridge Rectifier Features • Glass passivated chip junction • Low leakage • High surge current capability • Ideal fo.


* Glass passivated chip junction
* Low leakage
* High surge current capability
* Ideal for printed circuit boards DFM
* Reliable low cost construction utilizing molded plastic technique
* High temperature soldering guaranteed: 260˚C/10 seconds at 5lbs.(2.3kg) tension
* Small size, simple inst.

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