| Part Number | ES1DF Datasheet |
|---|---|
| Manufacturer | Taiwan Semiconductor |
| Overview | Green compound RATINGS AND CHARACTERISTICS CURVES (TA=25°C unless otherwise noted) AVERAGE FORWARD CURRENT (A) FIG.1 FORWARD CURRENT DERATING CURVE 1.2 1 0.8 0.6 0.4 0.2 RESISTIVE OR INDUCTIVE LOAD. - Glass passivated junction chip - Ideal for automated placement - Low profile package - Low power loss, high efficiency - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 MECHANICAF DATA Case: SMAF Molding compound: UL flammabil. |