| Part Number | ES2ABF Datasheet |
|---|---|
| Manufacturer | Yangjie Electronic |
| Overview |
ES2ABF THRU ES2KBF
RoHS
COMPLIANT
Surface Mount Super Fast Recovery Rectifier
Features
● Low profile package ● Ideal for automated placement ● Glass passivated chip junction ● High forward surge cap.
* Low profile package * Ideal for automated placement * Glass passivated chip junction * High forward surge capability * Super Fast reverse recovery time * Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C Typical Applications For use in high frequency rectification of power supplies, inve. |
ES2ABF Datasheet and Specifications PDF
The ES2ABF is a Surface Mount Super Fast Recovery Rectifier.
| Part Number | ES2ABF Datasheet |
|---|---|
| Description | Super-Fast Rectifiers |
| Manufacturer | Galaxy Microelectronics |
| Overview |
Super-Fast Rectifiers
Production specification
ES2ABF--ES2DBF
Features
For surface mounted applications Low profile package Low forward voltage drop High surge current capability RoHS Comp.
* For surface mounted applications * Low profile package * Low forward voltage drop * High surge current capability * RoHS Compliant Mechanical Data * Case: SMBF molded plastic * Molding compound, UL flammability classification rating 94V-0 * Terminals: Solder plated, solderable per MIL- STD-202,Met. |
| Part Number | ES2ABF Datasheet |
|---|---|
| Description | SURFACE MOUNT SUPERFAST RECOVERY RECTIFIER |
| Manufacturer | MIC |
| Overview | 1 Cathode 2 Anode 12 SimplifiedoutlineSMBFandsymbol Marking - ES2J/E2JB $%62/87(MAXIMUM RATINGS AND CHARACTERISTICS ͈ 5DWLQJVDW&DPELHQWWHPSHUDWXUHXQOHVVRWKHUZLVHVSHFLILHG6LQJOHSKDV. . |
| Part Number | ES2ABF Datasheet |
|---|---|
| Description | Surface Mount Superfast Recovery Rectifier |
| Manufacturer | Jingdao Microelectronics |
| Overview |
1 Cathode 2 Anode
12
Simplified outline SMBF and symbol
Absolute Maximum Ratings and Characteristics Ratings at 25 °C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, r.
* For surface mounted applications * Low profile package * Glass Passivated Chip Junction * Superfast reverse recovery time * Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA * Case: SMBF * Terminals: Solderable per MIL-STD-750, Method 2026 * Approx. Weight: 57mg / 0.002oz ES2. |