GLZ22A Datasheet

The GLZ22A is a SURFACE MOUNT ZENER DIODES.

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Part NumberGLZ22A
ManufacturerPanJit Semiconductor
Overview GLZ2.0 SERIES SURFACE MOUNT ZENER DIODES VOLTAGE 2.0 to 56 Volt POWER 500 mWatt FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lea.
* Planar Die construction
* 500mW Power Dissipation
* Ideally Suited for Automated Assembly Processes
* Lead free in compliance with EU RoHS 2011/65/EU directive MECHANICAL DATA
* Case: Molded Glass MINI-MELF
* Terminals: Solderable per MIL-STD-750, Method 2026
* Approx. Weight: 0.001 ounces, 0.03 .
Part NumberGLZ22A
Description500mW SURFACE MOUNT ZENER DIODE
ManufacturerWon-Top Electronics
Overview ® WON-TOP ELECTRONICS Features  Planar Die Construction  500mW Power Dissipation  2.0 – 56V Nominal Zener Voltage  Ideally Suited for Automated Assembly  For Use in Voltage Stabilizer or Referenc.
* Planar Die Construction
* 500mW Power Dissipation
* 2.0
* 56V Nominal Zener Voltage
* Ideally Suited for Automated Assembly
* For Use in Voltage Stabilizer or Reference Mechanical Data
* Case: MiniMELF, Molded Glass
* Terminals: Plated Leads Solderable per MIL-STD-202, Method 208
* Polarity: Catho.
Part NumberGLZ22A
Description500mW MINI MELF ZENER DIODE
ManufacturerFrontier Electronics
Overview FRONTIER ELECTRONICS CO., LTD. 500mW MINI MELF ZENER DIODE GLZ2.0A THRU GLZ36D FEATURES ! LOW COST ! SMALL SIZE ! GLASS SEALED MECHANICAL DATA ! CASE︰MINI MELF GLASS CASE ! TERMINALS:SOLDERABLE PER . ! LOW COST ! SMALL SIZE ! GLASS SEALED MECHANICAL DATA ! CASE︰MINI MELF GLASS CASE ! TERMINALS:SOLDERABLE PER MIL-STD -202, METHOD 208 ! POLARITY:COLOR BAND DENOTES CATHODE ! MOUNTING POSITION:ANY ! WEIGHT:0.036 GRAMS SOLDERABLE ENDS 1.35 ±0.05 3.3 ±0.1 0.3 ± 0.1 CASE:DO-213AA(GL34) DIMENSIONS .
Part NumberGLZ22A
DescriptionSURFACE MOUNT ZENER DIODES
ManufacturerRectron
Overview SURFACE MOUNT ZENER DIODES VOLTAGE RANGE 2.0 to 56 Volts 500mWatts GLZ SERIES FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • In comp.
* Planar Die construction
* 500mW Power Dissipation
* Ideally Suited for Automated Assembly Processes
* In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA
* Case: Molded Glass MINI-MELF
* Terminals: Solderable per MIL-STD-750, Method 2026
* Approx. Weight: 0.001 ounces, 0.03 grams.
* M.