| Part Number | GLZ27 |
|---|---|
| Manufacturer | General Semiconductor |
| Overview |
New Product
GLZ Series
Zener Diodes
VZ Range 3.3 to 39V Power Dissipation 500mW
MiniMELF (SOD-80C)
Cathode Mark
0.142 (3.6) 0.134 (3.4)
∅ 0.063 (1.6) 0.055 (1.4)
0.019 (0.48) 0.011 (0.28)
Dimens.
* Silicon Planar Zener Diodes * In MiniMELF case especially for automatic insertion * The Zener voltages are graded according to voltage bands instead of by tolerance. * Low Zener impedance and low leakage current * Popular in Asian designs Maximum Ratings and Thermal Characteristics (TA = 25°C unl. |
GLZ27 Datasheet
The GLZ27 is a Zener Diodes.
| Part Number | GLZ27 |
|---|---|
| Description | SURFACE MOUNT ZENER DIODES |
| Manufacturer | UPM |
| Overview | UPM GLZ2.0~GLZ56 SURFACE MOUNT ZENER DIODES Voltage Range 2.0-56 Volts Power 500mWatts Features * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes . * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes * Both normal and Pb free product are available : Normal : 80~95% Sn, 5~20% Pb Pb free: 98.5% Sn above MINI-MELF/LL-34 .063(1.6) .055(1.4)DIA. Mechanical Data Case: Molded Glass MINI-MELF Termina. |
| Part Number | GLZ27 |
|---|---|
| Description | ZENER DIODES |
| Manufacturer | EIC Semiconductor |
| Overview |
GLZ Series
VZ : 3.3 to 39V PD : 500mW
FEATURES :
• Silicon Planar Zener Diodes • In MiniMELF case especially for automatic insertion • The Zener voltages are graded according to v.
:
* Silicon Planar Zener Diodes * In MiniMELF case especially for automatic insertion * The Zener voltages are graded according to voltage bands instead of by tolerance. * Low Zener impedance and low leakage current * Pb / RoHS Free ZENER DIODES MiniMELF (SOD-80C) Cathode Mark φ 0.063 (1.64) 0.055. |
| Part Number | GLZ27 |
|---|---|
| Description | 500mW SUFACE MOUNT ZENER DIODE |
| Manufacturer | KD |
| Overview |
GLZ2.0 ~ GLZ56
500mW SUFACE MOUNT ZENER DIODE
FEATURES
• Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Both normal and Pb free product are avai.
* Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes * Both normal and Pb free product are available : Normal : 80~95% Sn, 5~20% Pb Pb free: 98.5% Sn above MECHANICAL DATA * Case: Molded Glass MINI-MELF * Terminals: Solderable per MIL-STD-750, Method . |