GLZ6.2 Datasheet and Specifications PDF

The GLZ6.2 is a SURFACE MOUNT ZENER DIODES.

Key Specifications

PackageMELF
Mount TypeSurface Mount
Pins2
Max Operating Temp175 °C
Min Operating Temp-55 °C
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Part NumberGLZ6.2 Datasheet
ManufacturerUPM
Overview UPM GLZ2.0~GLZ56 SURFACE MOUNT ZENER DIODES Voltage Range 2.0-56 Volts Power 500mWatts Features * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes . * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes * Both normal and Pb free product are available : Normal : 80~95% Sn, 5~20% Pb Pb free: 98.5% Sn above MINI-MELF/LL-34 .063(1.6) .055(1.4)DIA. Mechanical Data Case: Molded Glass MINI-MELF Termina.
Part NumberGLZ6.2 Datasheet
DescriptionZener Diodes
ManufacturerGeneral Semiconductor
Overview New Product GLZ Series Zener Diodes VZ Range 3.3 to 39V Power Dissipation 500mW MiniMELF (SOD-80C) Cathode Mark 0.142 (3.6) 0.134 (3.4) ∅ 0.063 (1.6) 0.055 (1.4) 0.019 (0.48) 0.011 (0.28) Dimens.
* Silicon Planar Zener Diodes
* In MiniMELF case especially for automatic insertion
* The Zener voltages are graded according to voltage bands instead of by tolerance.
* Low Zener impedance and low leakage current
* Popular in Asian designs Maximum Ratings and Thermal Characteristics (TA = 25°C unl.
Part NumberGLZ6.2 Datasheet
DescriptionZENER DIODES
ManufacturerEIC Semiconductor
Overview GLZ Series VZ : 3.3 to 39V PD : 500mW FEATURES : • Silicon Planar Zener Diodes • In MiniMELF case especially for automatic insertion • The Zener voltages are graded according to v. :
* Silicon Planar Zener Diodes
* In MiniMELF case especially for automatic insertion
* The Zener voltages are graded according to voltage bands instead of by tolerance.
* Low Zener impedance and low leakage current
* Pb / RoHS Free ZENER DIODES MiniMELF (SOD-80C) Cathode Mark φ 0.063 (1.64) 0.055.
Part NumberGLZ6.2 Datasheet
Description500mW SUFACE MOUNT ZENER DIODE
ManufacturerKD
Overview GLZ2.0 ~ GLZ56 500mW SUFACE MOUNT ZENER DIODE FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Both normal and Pb free product are avai.
* Planar Die construction
* 500mW Power Dissipation
* Ideally Suited for Automated Assembly Processes
* Both normal and Pb free product are available : Normal : 80~95% Sn, 5~20% Pb Pb free: 98.5% Sn above MECHANICAL DATA
* Case: Molded Glass MINI-MELF
* Terminals: Solderable per MIL-STD-750, Method .

Price & Availability

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