GS2K Datasheet and Specifications PDF

The GS2K is a 2.0 Amp Glass Passivated Rectifier.

Key Specifications

Max Operating Temp150 °C
Min Operating Temp-55 °C

GS2K Datasheet

GS2K Datasheet (Micro Commercial Components)

Micro Commercial Components

GS2K Datasheet Preview

1 Cathode Simplified Outline 2 Anode 1 MCC 2 XXXX XXXX = Marking code Graphic Symbol 1 2 Note: 1. Halogen free "Green” products are defined as those which contain <900ppm bromine, <900ppm c.


* Halogen Free. "Green" Device (Note 1)
* Glass Passivated Chip Junction
* High Forward Surge Capability
* Epoxy Meets UL 94 V-0 Flammability Rating
* Moisture Sensitivity Level 1
* Lead Free Finish/RoHS Compliant (Note 2)("P" Suffix Designates RoHS Compliant. See Ordering Information) Maximum Rati.

GS2K Datasheet (Zibo Seno)

Zibo Seno

GS2K Datasheet Preview

Z ibo Seno Electronic Engineering Co., Ltd. GS2A-GS2M 2.0A SURFACE MOUNT GLASS PASSIVATED RECTIFIER Features ! Glass Passivated Die Construction ! Ideally Suited for Automatic Assembly ! Low Forwar.

! Glass Passivated Die Construction ! Ideally Suited for Automatic Assembly ! Low Forward Voltage Drop ! Surge Overload Rating to 60A Peak ! Low Power Loss ! Built-in Strain Relief !! Plastic Case Material has UL Flammability Classification Rating 94V-O B D A J C HG E Mechanical Data ! Case: Mo.

GS2K Datasheet (First Silicon)

First Silicon

GS2K Datasheet Preview

SEMICONDUCTOR TECHNICAL DATA GS2A ~ GS2M General Purpose Rectifier ■ Features ● Io 1.5A ● VRRM 50V-1000V ● High surge current capability ● Cases: Molded plastic ■ Applications ● Rectifier ■ .


* Io 1.5A
* VRRM 50V-1000V
* High surge current capability
* Cases: Molded plastic
* Applications
* Rectifier
* Outline Dimensions and Mark D O -214A A (S M B ) .085(2.15) .073(1.85) .155(3.94) .130(3.30) M ounting Pad Layout .187(4.75) .167(4.25) 0.069 (1.76) .103(2.61) .078(1.99) .05.

GS2K Datasheet (YFD)

YFD

GS2K Datasheet Preview

ShenZhen YueFeiDa Electronics Technology Co.,Ltd GS2A THRU GS2M 2AMP. GLASS PASSIVATED SURFACE MOUNT RECTIFIERS FEATURE .High current capability, .Low forward voltage drop .Low power loss, high ef.

.High current capability, .Low forward voltage drop .Low power loss, high efficiency .High surge capability .High temperature soldering guaranteed Fig1: SMA/DO-214AC* FOR OPEN JUNCTION DICE PACKAGING OUTLINE 260°C /1 0sec/0.375" lead length at 5 lbs tension .For surface mounted application. .Easy.

Price & Availability

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Future Electronics 7500 7500+ : 0.0345 USD
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30000+ : 0.0334 USD
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TME 0 10+ : 0.08 EUR
50+ : 0.0605 EUR
250+ : 0.0534 EUR
1000+ : 0.048 EUR
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