| Part Number | LI1206H151R-10 Datasheet |
|---|---|
| Manufacturer | Unknown Manufacturer |
| Overview | . . |
LI1206H151R-10 Datasheet and Specifications PDF
The LI1206H151R-10 is a Surface Mount Ferrite Chip.
Key Specifications
| Package | 1206 |
|---|---|
| Mount Type | Surface Mount |
| Pins | 1206 |
| Max Frequency | 1 GHz |
| Height | 1.1 mm |
| Length | 3.2 mm |
| Width | 1.6 mm |
| Max Operating Temp | 125 °C |
| Part Number | LI1206H151R-10 Datasheet |
|---|---|
| Description | Surface Mount Ferrite Chip |
| Manufacturer | Steward |
| Overview |
HI High Current Chips ( > 3 Amps) MI Mid Current Chips (1-2.5 Amps) HR High Retention Under Bias
LI Low Current Chips (< 1 Amp and < 400 Ohms) HZ High Impedance Chips (<1 Amp and > 400 Ohms) HF High.
* Small footprint * Excellent retention under bias * Rugged, monolithic construction * Superior impedance vs. frequency characteristics * Economical * Broad range of sizes ( from 0402 up to 3312 ) * Broad range of impedance values and current ratings Applications: * Filtering. |
| Part Number | LI1206H151R-10 Datasheet |
|---|---|
| Description | Surface Mount Ferrite Chip |
| Manufacturer | Laird |
| Overview | High Current Chips ( > 3 Amps ) Mid Current Chips ( 1 Amp to < 3 Amps ) High Retention Under Bias 4 Line Chip Array ( Page 4 ) DESCRIPTION / SPECIAL FEATURES METRIC PKG. SIZE Low Current Chips ( < 1. 0402 Part Size Code ( EIA ) A Rated Continuous Current Code LI HZ HF LF 152 Impedance Value Code R Packaging Code -10 Additional Description High Current Chips ( > 3 Amps ) Mid Current Chips ( 1 Amp to < 3 Amps ) High Retention Under Bias 4 Line Chip Array ( Page 4 ) DESCRIPTION / SPECIAL FEA. |
| Part Number | LI1206H151R-10 Datasheet |
|---|---|
| Description | Ferrite EMI Chip Beads |
| Manufacturer | Laird |
| Overview |
High Current Chips ( > 3 Amps ) Mid Current Chips ( 1 Amp to < 3 Amps ) High Retention Under Bias 4 Line Chip Array ( Page 4 )
DESCRIPTION / SPECIAL FEATURES METRIC PKG. SIZE
Low Current Chips ( < 1.
* Up to 10 Amps (I MAX) continuous operating capability * Low DCR * Vibration Resistant * Rugged monolithic construction * Small footprint * Excellent retention under bias * Superior impedance vs. frequency characteristics * Economical * Broad range of sizes ( from EIA 0402 up to 3312 ) * Broad ran. |