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MMBZ5231BW Datasheet

The MMBZ5231BW is a 200mW SURFACE MOUNT ZENER DIODE. Download the datasheet PDF and view key features and specifications below.

Part NumberMMBZ5231BW
ManufacturerWon-Top Electronics
Overview ® WON-TOP ELECTRONICS MMBZ5221BW – MMBZ5262BW 200mW SURFACE MOUNT ZENER DIODE Pb Features  Planar Die Construction  200mW Power Dissipation  2.4V – 51V Nominal Zener Voltage  5% Standard Vz Tole.
* Planar Die Construction
* 200mW Power Dissipation
* 2.4V
  – 51V Nominal Zener Voltage
* 5% Standard Vz Tolerance
* Designed for Surface Mount Application
* Plastic Material
  – UL Recognition Flammability Classification 94V-0 B Mechanical Data
* Case: SOT-323, Molded Plastic K
* Terminals: Plate.
Part NumberMMBZ5231BW
DescriptionSURFACE MOUNT SILICON ZENER DIODES
ManufacturerPanJit Semiconductor
Overview MMBZ5221BW~MMBZ5262BW SURFACE MOUNT SILICON ZENER DIODES VOLTAGE 2.4 to 51 Volts POWER 200 mWatts FEATURES • Planar Die construction • 200mW Power Dissipation • Zener Voltages from 2.4V~51V • Idea.
* Planar Die construction
* 200mW Power Dissipation
* Zener Voltages from 2.4V~51V
* Ideally Suited for Automated Assembly Processes
* In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA
* Case: SOT-323, Plastic
* Terminals: Solderable per MIL-STD-750, Method 2026
* Apporx. Weight: 0.0.
Part NumberMMBZ5231BW
DescriptionZENER DIODE
ManufacturerJCET
Overview JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD SOT-323 Plastic-Encapsulate Diode MMBZ5221BW-MMBZ5259BW ZENER DIODE FEATURES： Planar Die Construction 200mW Power Dissipation on FR-4 PCB General pu. Planar Die Construction 200mW Power Dissipation on FR-4 PCB General purpose, Medium Current Ideally Suited for Automated Assembly Marking: see table on page2 The first code SOT- 323 Maximum Ratings(Ta= 25℃ unless otherwise specified) Characteristic Forward Voltage @ IF = 10mA Power Dissipation T.
Part NumberMMBZ5231BW
DescriptionSURFACE MOUNT SILICON ZENER DIODES
ManufacturerDC COMPONENTS
Overview DC COMPONENTS CO., LTD. MMBZ5221BW THRU R RECTIFIER SPECIALISTS MMBZ5259BW TECHNICAL SPECIFICATIONS OF SURFACE MOUNT SILICON ZENER DIODES FEATURES * Planar Die construction * Zener Voltages from 2. * Planar Die construction * Zener Voltages from 2.4V - 39V * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MECHANICAL DATA * Case: Molded Plastic * Terminals:Solder plated, solderable per MIL-STD-202, Method 208 * Polarity: See Diagram Below * Mounting position: Any * Wei.

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