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MMBZ5232B Datasheet

The MMBZ5232B is a 350mW SURFACE MOUNT ZENER DIODE. Download the datasheet PDF and view key features and specifications below.

Part NumberMMBZ5232B
ManufacturerWon-Top Electronics
Overview WTE POWER SEMICONDUCTORS MMBZ5221B – MMBZ5262B Pb 350mW SURFACE MOUNT ZENER DIODE Features Planar Die Construction 350mW Power Dissipation 2.4 – 51V Nominal Zener Voltage 5% Stan. Planar Die Construction 350mW Power Dissipation 2.4
  – 51V Nominal Zener Voltage 5% Standard Vz Tolerance Designed for Surface Mount Application Plastic Material
  – UL Recognition Flammability Classification 94V-O B Mechanical Data Case: SOT-23, Molded Plastic K Terminals: Plated Leads Solderable.
Part NumberMMBZ5232B
DescriptionSurface Mount Zener Diodes
ManufacturerWEITRON
Overview Surface Mount Zener Diodes Features: *225mw Power Dissipation *Ideal for Surface Mountted Application *Zener Breakdown Voltage Range 2.4V to 91V Mechanical Data: *Case : SOT-23 Molded plastic *Termina. *225mw Power Dissipation *Ideal for Surface Mountted Application *Zener Breakdown Voltage Range 2.4V to 91V Mechanical Data: *Case : SOT-23 Molded plastic *Terminals: Solderable per MIL-STD-202, Method 208 *Polarity: Cathode Indicated by Polarity Band *Marking: Marking Code (See Table on Page 3) *W.
Part NumberMMBZ5232B
Description410 mW Zener Diode 2.4 to 39 Volts
ManufacturerMicro Commercial Components
Overview MCC Micro Commercial Corp. 21201 Itasca St. Chatsworth, CA 91311 Phone: (818) 701-4933 Fax: (818) 701-4939 MMBZ5221B THRU MMBZ5259B 410 mW Zener Diode 2.4 to 39 Volts SOT-23 A D Features • • • • Wid.
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* Wide Voltage Range Available Small Outline Package For Space Savings High Temp Soldering: 250°C for 10 Seconds At Terminals Surface Mount Package Maximum Ratings
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* Operating Junction Temperature: -55°C to +150°C Storage Temperature: -55°C to +150°C 500 mWatt DC Power Dissipation Maxim.
Part NumberMMBZ5232B
Description350mW SURFACE MOUNT ZENER DIODE
ManufacturerDiodes Incorporated
Overview MMBZ5221B - MMBZ5259B 350mW SURFACE MOUNT ZENER DIODE Features  Planar Die Construction  350mW Power Dissipation on FR-4 PCB  Ideally Suited for Automated Assembly Processes  Totally Lead-Free & .
* Planar Die Construction
* 350mW Power Dissipation on FR-4 PCB
* Ideally Suited for Automated Assembly Processes
* Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
* Halogen and Antimony Free. “Green” Device (Note 3)
* For automotive applications requiring specific change control (i.e.: parts.

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