| Part Number | MMBZ5240BW |
|---|---|
| Manufacturer | PanJit Semiconductor |
| Overview |
MMBZ5221BW~MMBZ5262BW
SURFACE MOUNT SILICON ZENER DIODES
VOLTAGE 2.4 to 51 Volts
POWER 200 mWatts
FEATURES
• Planar Die construction • 200mW Power Dissipation • Zener Voltages from 2.4V~51V • Idea.
* Planar Die construction * 200mW Power Dissipation * Zener Voltages from 2.4V~51V * Ideally Suited for Automated Assembly Processes * In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA * Case: SOT-323, Plastic * Terminals: Solderable per MIL-STD-750, Method 2026 * Apporx. Weight: 0.0. |
MMBZ5240BW Datasheet
The MMBZ5240BW is a SURFACE MOUNT SILICON ZENER DIODES.
| Part Number | MMBZ5240BW |
|---|---|
| Description | 200mW Zener Diode |
| Manufacturer | Micro Commercial Components |
| Overview |
MCC
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Micro Commercial Components
omponents 20736 Marilla Street Chatsworth !"# $
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MMBZ5221BW THRU
MMBZ5259BW
Features
• Halogen .
* Halogen free available upon request by adding suffix "-HF" * Wide Voltage Range Available * Small Outline Package For Space Savings * High Temp Soldering: 260°C for 10 Seconds At Terminals * Surface Mount Package * Epoxy meets UL 94 V-0 flammability rating * Moisture Sensitivity Level 1 Maximum Ra. |
| Part Number | MMBZ5240BW |
|---|---|
| Description | SURFACE MOUNT SILICON ZENER DIODES |
| Manufacturer | DC COMPONENTS |
| Overview | DC COMPONENTS CO., LTD. MMBZ5221BW THRU R RECTIFIER SPECIALISTS MMBZ5259BW TECHNICAL SPECIFICATIONS OF SURFACE MOUNT SILICON ZENER DIODES FEATURES * Planar Die construction * Zener Voltages from 2. * Planar Die construction * Zener Voltages from 2.4V - 39V * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MECHANICAL DATA * Case: Molded Plastic * Terminals:Solder plated, solderable per MIL-STD-202, Method 208 * Polarity: See Diagram Below * Mounting position: Any * Wei. |
| Part Number | MMBZ5240BW |
|---|---|
| Description | ZENER DIODE |
| Manufacturer | JCET |
| Overview | JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD SOT-323 Plastic-Encapsulate Diode MMBZ5221BW-MMBZ5259BW ZENER DIODE FEATURES： Planar Die Construction 200mW Power Dissipation on FR-4 PCB General pu. Planar Die Construction 200mW Power Dissipation on FR-4 PCB General purpose, Medium Current Ideally Suited for Automated Assembly Marking: see table on page2 The first code SOT- 323 Maximum Ratings(Ta= 25℃ unless otherwise specified) Characteristic Forward Voltage @ IF = 10mA Power Dissipation T. |