MMBZ5241BW Datasheet

The MMBZ5241BW is a SURFACE MOUNT SILICON ZENER DIODES.

Datasheet4U Logo
Part NumberMMBZ5241BW
ManufacturerPanJit Semiconductor
Overview MMBZ5221BW~MMBZ5262BW SURFACE MOUNT SILICON ZENER DIODES VOLTAGE 2.4 to 51 Volts POWER 200 mWatts FEATURES • Planar Die construction • 200mW Power Dissipation • Zener Voltages from 2.4V~51V • Idea.
* Planar Die construction
* 200mW Power Dissipation
* Zener Voltages from 2.4V~51V
* Ideally Suited for Automated Assembly Processes
* In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA
* Case: SOT-323, Plastic
* Terminals: Solderable per MIL-STD-750, Method 2026
* Apporx. Weight: 0.0.
Part NumberMMBZ5241BW
Description200mW SURFACE MOUNT ZENER DIODE
ManufacturerDiodes Incorporated
Overview Features • Small Surface Mount Package • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Note 3) •.
* Small Surface Mount Package
* Ideally Suited for Automated Assembly Processes
* Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
* Halogen and Antimony Free. “Green” Device (Note 3)
* Qualified to AEC-Q101 Standards for High Reliability MMBZ5221BW - MMBZ5259BW 200mW SURFACE MOUNT ZENER DIOD.
Part NumberMMBZ5241BW
DescriptionZENER DIODE
ManufacturerJCET
Overview JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD SOT-323 Plastic-Encapsulate Diode MMBZ5221BW-MMBZ5259BW ZENER DIODE FEATURES: Planar Die Construction 200mW Power Dissipation on FR-4 PCB General pu. Planar Die Construction 200mW Power Dissipation on FR-4 PCB General purpose, Medium Current Ideally Suited for Automated Assembly Marking: see table on page2 The first code SOT- 323 Maximum Ratings(Ta= 25℃ unless otherwise specified) Characteristic Forward Voltage @ IF = 10mA Power Dissipation T.
Part NumberMMBZ5241BW
Description200mW SURFACE MOUNT SILICON ZENER DIODES
ManufacturerWILLAS
Overview 200mW SURFACE MOUNT SILICON ZENER DIODES 2.4V ~39V SOT-323 PACKAGE MMBZ5221BW THRU MMBZ5259BW Pb Free Product .004(.10)MIN. .087(2.2) .078(2.0) FEATURES * Planar Die construction * 200mW Power Diss. * Planar Die construction * 200mW Power Dissipation * Zener Voltages from 2.4V - 39V * Ultra-Small Surface Mount Package Power dissipation MECHANICAL DATA * Case: SOT-323, Molded Plastic * Terminals: Solderable per MIL-STD-202E, Method 208 * Polarity: See Diagram Below * Approx. Weight: 0.006 grams .