MMBZ5243BW Datasheet

The MMBZ5243BW is a SURFACE MOUNT SILICON ZENER DIODES.

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Part NumberMMBZ5243BW
ManufacturerDC COMPONENTS
Overview DC COMPONENTS CO., LTD. MMBZ5221BW THRU R RECTIFIER SPECIALISTS MMBZ5259BW TECHNICAL SPECIFICATIONS OF SURFACE MOUNT SILICON ZENER DIODES FEATURES * Planar Die construction * Zener Voltages from 2. * Planar Die construction * Zener Voltages from 2.4V - 39V * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MECHANICAL DATA * Case: Molded Plastic * Terminals:Solder plated, solderable per MIL-STD-202, Method 208 * Polarity: See Diagram Below * Mounting position: Any * Wei.
Part NumberMMBZ5243BW
DescriptionSURFACE MOUNT SILICON ZENER DIODES
ManufacturerPanJit Semiconductor
Overview MMBZ5221BW~MMBZ5262BW SURFACE MOUNT SILICON ZENER DIODES VOLTAGE 2.4 to 51 Volts POWER 200 mWatts FEATURES • Planar Die construction • 200mW Power Dissipation • Zener Voltages from 2.4V~51V • Idea.
* Planar Die construction
* 200mW Power Dissipation
* Zener Voltages from 2.4V~51V
* Ideally Suited for Automated Assembly Processes
* In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA
* Case: SOT-323, Plastic
* Terminals: Solderable per MIL-STD-750, Method 2026
* Apporx. Weight: 0.0.
Part NumberMMBZ5243BW
DescriptionZENER DIODE
ManufacturerJCET
Overview JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD SOT-323 Plastic-Encapsulate Diode MMBZ5221BW-MMBZ5259BW ZENER DIODE FEATURES： Planar Die Construction 200mW Power Dissipation on FR-4 PCB General pu. Planar Die Construction 200mW Power Dissipation on FR-4 PCB General purpose, Medium Current Ideally Suited for Automated Assembly Marking: see table on page2 The first code SOT- 323 Maximum Ratings(Ta= 25℃ unless otherwise specified) Characteristic Forward Voltage @ IF = 10mA Power Dissipation T.
Part NumberMMBZ5243BW
Description200mW SURFACE MOUNT SILICON ZENER DIODES
ManufacturerWILLAS
Overview 200mW SURFACE MOUNT SILICON ZENER DIODES 2.4V ~39V SOT-323 PACKAGE MMBZ5221BW THRU MMBZ5259BW Pb Free Product .004(.10)MIN. .087(2.2) .078(2.0) FEATURES * Planar Die construction * 200mW Power Diss. * Planar Die construction * 200mW Power Dissipation * Zener Voltages from 2.4V - 39V * Ultra-Small Surface Mount Package Power dissipation MECHANICAL DATA * Case: SOT-323, Molded Plastic * Terminals: Solderable per MIL-STD-202E, Method 208 * Polarity: See Diagram Below * Approx. Weight: 0.006 grams .

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