MMSZ5232B Datasheet

The MMSZ5232B is a SURFACE MOUNT SILICON ZENER DIODES.

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Part NumberMMSZ5232B
ManufacturerHITANO
Overview HITANO ENTERPRISE CORP. MMSZ5221B THRU MMSZ5259B TECHNICAL SPECIFICATIONS OF SURFACE MOUNT SILICON ZENER DIODES FEATURES * Planar Die construction * Zener Voltages from 2.4V - 39V * 500mW Power Diss. * Planar Die construction * Zener Voltages from 2.4V - 39V * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes SOD-123 MECHANICAL DATA * Case: Molded Plastic * Terminals:Solder plated, solderable per MIL-STD-202, Method 208 * Polarity: See Diagram Below * Mounting position:.
Part NumberMMSZ5232B
Description500mW SURFACE MOUNT SILICON ZENER DIODES
ManufacturerWILLAS
Overview 500mW SURFACE MOUNT SILICON ZENER DIODES 2.4V ~ 75V MMSZ5221B THRU MMSZ5267B PRIMARY CHARACTERISTICS PD 500mW VZ 2.4V~75V IZT TJ,Max Please refer to the specification 150℃ SOD-123 PACKAGE Marki.
* Planar Die Construction
* Ultra-Small Surface Mount Package
* General purpose, Medium Current
* Ideally Suited for Automated Assembly Processes
* Moisture Sensitivity Level 1 MECHANICAL DATA
* Case:Molded plastic,SOD-123
* Polarity:As Above Marked
* Terminals :Plated terminals, solderable per MIL.
Part NumberMMSZ5232B
DescriptionSURFACE MOUNT SILICON ZENER DIODES
ManufacturerPanJit Semiconductor
Overview MMSZ5221B ~ MMSZ5267B Series SURFACE MOUNT SILICON ZENER DIODES VOLTAGE 2.4 to 75 Volt POWER 500 mWatt FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated A.
* Planar Die construction
* 500mW Power Dissipation
* Ideally Suited for Automated Assembly Processes
* Lead free in compliance with EU RoHS 2.0
* Green molding compound as per IEC 61249 standard MECHANICAL DATA
* Case : SOD-123, Molded Plastic
* Terminals : Solderable per MIL-STD-750, Method 2026 .
Part NumberMMSZ5232B
DescriptionSurface mount zener diode
ManufacturerBruckewell Technology
Overview MMSZ5221B-MMSZ5260B Surface mount zener diode Features • Planar die construction. • 500mW power dissipation. • General purpose, medium current. • Ideally suited for automated assembly processes. • RoH.
* Planar die construction.
* 500mW power dissipation.
* General purpose, medium current.
* Ideally suited for automated assembly processes.
* RoHS compliant package Applications
* Zener diode.
* Ultra-small surface mount package. Packing & Order Information 3,000/Reel Graphic symbol MAXIMUM RATING.