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MMSZ5242B Datasheet

The MMSZ5242B is a ZENER DIODE. Download the datasheet PDF and view key features and specifications below.

Part NumberMMSZ5242B
ManufacturerJCET
Overview JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD SOD-123 Plastic-Encapsulate Diodes MMSZ5221B-MMSZ5259B ZENER DIODE FEATURES • Planar Die Construction • Ultra-Small Surface Mount Package • General .
* Planar Die Construction
* Ultra-Small Surface Mount Package
* General purpose, Medium Current
* Ideally Suited for Automated Assembly Processes SOD-123 Maximum Ratings(Ta=25℃ unless otherwise specified) Characteristic Symbol Forward Voltage (Note 2) @ IF = 10mA VF Power Dissipation(Note 1).
Part NumberMMSZ5242B
Description500mW SURFACE MOUNT ZENER DIODE
ManufacturerWon-Top Electronics
Overview ® WON-TOP ELECTRONICS MMSZ5221B – MMSZ5262B 500mW SURFACE MOUNT ZENER DIODE Pb Features  Planar Die Construction  500mW Power Dissipation  2.4V – 51V Nominal Zener Voltage  5% Standard Vz Tolera.
* Planar Die Construction
* 500mW Power Dissipation
* 2.4V
* 51V Nominal Zener Voltage
* 5% Standard Vz Tolerance
* Designed for Surface Mount Application
* Plastic Material
* UL Recognition Flammability Classification 94V-0 C A B Mechanical Data
* Case: SOD-123, Molded Plastic
* Terminals: Plate.
Part NumberMMSZ5242B
DescriptionSURFACE MOUNT SILICON ZENER DIODES
ManufacturerHITANO
Overview HITANO ENTERPRISE CORP. MMSZ5221B THRU MMSZ5259B TECHNICAL SPECIFICATIONS OF SURFACE MOUNT SILICON ZENER DIODES FEATURES * Planar Die construction * Zener Voltages from 2.4V - 39V * 500mW Power Diss. * Planar Die construction * Zener Voltages from 2.4V - 39V * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes SOD-123 MECHANICAL DATA * Case: Molded Plastic * Terminals:Solder plated, solderable per MIL-STD-202, Method 208 * Polarity: See Diagram Below * Mounting position:.
Part NumberMMSZ5242B
DescriptionSURFACE MOUNT SILICON ZENER DIODES
ManufacturerPanJit Semiconductor
Overview MMSZ5221B ~ MMSZ5267B Series SURFACE MOUNT SILICON ZENER DIODES VOLTAGE 2.4 to 75 Volt POWER 500 mWatt FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated A.
* Planar Die construction
* 500mW Power Dissipation
* Ideally Suited for Automated Assembly Processes
* Lead free in compliance with EU RoHS 2.0
* Green molding compound as per IEC 61249 standard MECHANICAL DATA
* Case : SOD-123, Molded Plastic
* Terminals : Solderable per MIL-STD-750, Method 2026 .

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