MMSZ5248BS Datasheet

The MMSZ5248BS is a 200mW Surface Mount Zener Diode.

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Part NumberMMSZ5248BS
ManufacturerTaiwan Semiconductor
Overview MMSZ5221BS THRU MMSZ5259BS 200mW Surface Mount Zener Diode Voltage Range 2.4 to 39 Volts 200m Watts Power Dissipation Features Planar die construction 200 mW power dissipation Ideally suited for aut. Planar die construction 200 mW power dissipation Ideally suited for automated assembly processes General purpose, medium current Standard zener voltage tolerance is ±5% Plastic Material
* UL recognition flammability classification 94V-0 Mechanical Data 0.037(0.95) Max. SOD-323 0.010(0.25) Typ. Min.
Part NumberMMSZ5248BS
Description200mW SURFACE MOUNT SILICON ZENER DIODES
ManufacturerWILLAS
Overview 200mW SURFACE MOUNT SILICON ZENER DIODES 2.4V~39V MMSZ5221BS THRU MMSZ5259BS PRIMARY CHARACTERISTICS PD 200mW VZ 2.4V~39V IZT TJ,Max Please refer to the specification 150℃ FEATURES  Planar Die.
* Planar Die construction
* 200mW Power Dissipation
* Zener Voltages from 2.4~39V
* Ideally Suited for Automated Assembly Processes
* Moisture Sensitivity Level 1 SOD-323 PACKAGE
* Body Marking: Please refer to the specification Ex : MMSZ5237BS Cathode Band F2 Marking Code MECHANICAL DATA
* Case:Mo.
Part NumberMMSZ5248BS
DescriptionSurface mount zener diode
ManufacturerLGE
Overview MMSZ5221BS-MMSZ5262BS Surface mount zener diode Pb FEATURES Lead-free z Planar die construction z General purpose, medium current z Ideally suited for automated assembly processes SOD-323 APPLI. Lead-free z Planar die construction z General purpose, medium current z Ideally suited for automated assembly processes SOD-323 APPLICATIONS z Zener diode z Ultra-small surface mount package Dimensions in inches and (millimeters) MAXIMUM RATING @ Ta=25℃ unless otherwise specified Characteris.
Part NumberMMSZ5248BS
DescriptionSURFACE MOUNT ZENER DIODE
ManufacturerRFE
Overview SURFACE MOUNT ZENER DIODE MMSZ5221BS ~ MMSZ5262BS SOD-323 FEATURES • Planar die construction • General purpose, medium current • Ideally suited for automated assembly processes APPLICATIONS • Referenc.
* Planar die construction
* General purpose, medium current
* Ideally suited for automated assembly processes APPLICATIONS
* Reference Voltage MAXIMUM RATINGS Rating at 25°C ambient temperature unless otherwise specified. Parameter Forward Voltage Drop IFM = 10mA Power Dissipation Typical Thermal .