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MMSZ5259B Datasheet

The MMSZ5259B is a ZENER DIODE. Download the datasheet PDF and view key features and specifications below.

Part NumberMMSZ5259B
ManufacturerJCET
Overview JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD SOD-123 Plastic-Encapsulate Diodes MMSZ5221B-MMSZ5259B ZENER DIODE FEATURES • Planar Die Construction • Ultra-Small Surface Mount Package • General .
* Planar Die Construction
* Ultra-Small Surface Mount Package
* General purpose, Medium Current
* Ideally Suited for Automated Assembly Processes SOD-123 Maximum Ratings(Ta=25℃ unless otherwise specified) Characteristic Symbol Forward Voltage (Note 2) @ IF = 10mA VF Power Dissipation(Note 1).
Part NumberMMSZ5259B
DescriptionSurface Mount Zener Diode
ManufacturerTaiwan Semiconductor
Overview Small Signal Product MMSZ5221B ~ MMSZ5263B Taiwan Semiconductor 500mW, 5% Tolerance SMD Zener Diode MMSZM5M2S6Z3M5BM2S5Z5M5BM2S5Z3M5BM2S4Z9M5BM2S4Z7M5BM2S4Z4M5BM2S3Z8M5BM2S3Z3M5BM2S2Z4M5BM2S2Z35B22. - Wide zener voltage range selection: 2.4V to 56V - Surface Mount Device Type - Moisture sensitivity level 1 - Pb free and RoHS compliant - Green compound (Halogen free) with suffix "G" on packing code and prefix "G" on date code - VZ Tolerance Selection of ±5% - Matte Tin(Sn) lead finish SOD-123F .
Part NumberMMSZ5259B
DescriptionSurface mount zener diode
ManufacturerBruckewell Technology
Overview MMSZ5221B-MMSZ5260B Surface mount zener diode Features • Planar die construction. • 500mW power dissipation. • General purpose, medium current. • Ideally suited for automated assembly processes. • RoH.
* Planar die construction.
* 500mW power dissipation.
* General purpose, medium current.
* Ideally suited for automated assembly processes.
* RoHS compliant package Applications
* Zener diode.
* Ultra-small surface mount package. Packing & Order Information 3,000/Reel Graphic symbol MAXIMUM RATING.
Part NumberMMSZ5259B
DescriptionSURFACE MOUNT SILICON ZENER DIODES
ManufacturerPanJit Semiconductor
Overview MMSZ5221B ~ MMSZ5267B Series SURFACE MOUNT SILICON ZENER DIODES VOLTAGE 2.4 to 75 Volt POWER 500 mWatt FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated A.
* Planar Die construction
* 500mW Power Dissipation
* Ideally Suited for Automated Assembly Processes
* Lead free in compliance with EU RoHS 2.0
* Green molding compound as per IEC 61249 standard MECHANICAL DATA
* Case : SOD-123, Molded Plastic
* Terminals : Solderable per MIL-STD-750, Method 2026 .