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MMSZ5260BS Datasheet

The MMSZ5260BS is a Surface mount zener diode. Download the datasheet PDF and view key features and specifications below.

Part NumberMMSZ5260BS
ManufacturerLGE
Overview MMSZ5221BS-MMSZ5262BS Surface mount zener diode Pb FEATURES Lead-free z Planar die construction z General purpose, medium current z Ideally suited for automated assembly processes SOD-323 APPLI. Lead-free z Planar die construction z General purpose, medium current z Ideally suited for automated assembly processes SOD-323 APPLICATIONS z Zener diode z Ultra-small surface mount package Dimensions in inches and (millimeters) MAXIMUM RATING @ Ta=25℃ unless otherwise specified Characteris.
Part NumberMMSZ5260BS
Description200mW SURFACE MOUNT ZENER DIODE
ManufacturerWon-Top Electronics
Overview WTE POWER SEMICONDUCTORS MMSZ5221BS – MMSZ5262BS Pb 200mW SURFACE MOUNT ZENER DIODE Features Planar Die Construction 200mW Power Dissipation 2.4 – 51V Nominal Zener Voltage 5% Standard Vz Tolerance. Planar Die Construction 200mW Power Dissipation 2.4
  – 51V Nominal Zener Voltage 5% Standard Vz Tolerance Designed for Surface Mount Application Plastic Material
  – UL Recognition Flammability Classification 94V-O C Mechanical Data Case: SOD-323, Molded Plastic Terminals: Plated Leads Solderable pe.
Part NumberMMSZ5260BS
DescriptionSurface Mount Zener Diodes
ManufacturerKexin Semiconductor
Overview SMD Type Surface Mount Zener Diodes MMSZ5221BS - MMSZ5260BS Diodes Features Ultra-Small Surface Mount Package Planar Die Construction General Purpose Absolute Maximum Ratings (Ta = 25 ) Parameter . Ultra-Small Surface Mount Package Planar Die Construction General Purpose Absolute Maximum Ratings (Ta = 25 ) Parameter Power dissipation Thermal Resistance, Junction to Ambient Air Forward Voltage @ IF = 10mA Jumction temperature Storage temperature Symbol P R JA VF Tj Tstg Rating 200 625 0.9 15.
Part NumberMMSZ5260BS
DescriptionSURFACE MOUNT ZENER DIODE
ManufacturerRFE
Overview SURFACE MOUNT ZENER DIODE MMSZ5221BS ~ MMSZ5262BS SOD-323 FEATURES • Planar die construction • General purpose, medium current • Ideally suited for automated assembly processes APPLICATIONS • Referenc.
* Planar die construction
* General purpose, medium current
* Ideally suited for automated assembly processes APPLICATIONS
* Reference Voltage MAXIMUM RATINGS Rating at 25°C ambient temperature unless otherwise specified. Parameter Forward Voltage Drop IFM = 10mA Power Dissipation Typical Thermal .

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