SMA4738A Datasheet and Specifications PDF

The SMA4738A is a Zener Diodes.

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Part NumberSMA4738A Datasheet
ManufacturerYangjie Electronic
Overview SMA47 SERIES () Zener Diodes ■ Features ●Ptot 1.0W ●Vz 3.3V-100V .062(1.58) .049(1.25) .187(4.75) .167(4.25) ■ Outline Dimensions and Mark Mounting Pad Layout 0.065 (1.66) 0.080 (2.04) 0.077(1.96) ..
*Ptot 1.0W
*Vz 3.3V-100V .062(1.58) .049(1.25) .187(4.75) .167(4.25)
* Outline Dimensions and Mark Mounting Pad Layout 0.065 (1.66) 0.080 (2.04) 0.077(1.96) .012(0.31) .006(0.15) 0.220 (5.58) DO-214AC(SMA) .111(2.83) .094(2.40)
*  Applications 
*  Stabilizing Voltage .091(2.30) .075(1.90) .056(.
Part NumberSMA4738A Datasheet
DescriptionSurface Mount Zener Diodes
ManufacturerSOCAY
Overview Surface Mount Zener Diodes SMA4728A - SZ1330A Series VZ: 3.3 To 330 V Features u Glass passivated chip u Low leakage u Built-in strain relief u Low inductance u High peak reverse power dissipation u L. u Glass passivated chip u Low leakage u Built-in strain relief u Low inductance u High peak reverse power dissipation u Lead-Free component u For use in stabilizing and clipping with high power rating PD: 1 W Mechanical Data u Case: Molded plastic u Epoxy: UL 94V-0 rate flame retardant u Lead: Sol.
Part NumberSMA4738A Datasheet
DescriptionSurface Mount Zener Diodes
ManufacturerANOVA
Overview SMA4728A-SZ1330A VZ: 3.3 to 330 V PD: 1 W Features ● Glass passivated chip ● Low leakage ● Built-in strain relief ● Low inductance ● High peak reverse power dissipation ● Lead (Pb)-free component ● F.
* Glass passivated chip
* Low leakage
* Built-in strain relief
* Low inductance
* High peak reverse power dissipation
* Lead (Pb)-free component
* For use in stabilizing and clipping circuits with high power rating Mechanical Data
* Case: Molded plastic
* Epoxy: UL 94V-0 rate flame retardant
* Lead:.
Part NumberSMA4738A Datasheet
DescriptionSurface Mount Zener Diodes
ManufacturerCYStech Electronics
Overview CYStech Electronics Corp. Surface Mount Zener Diodes VZ : 3.3 to 330V PD=1W SMA4728A thru SZ1330A Spec. No. : C604SA Issued Date : 2016.09.05 Revised Date : Page No. : 1/7 Features  Glass passivate.
* Glass passivated chip
* Low leakage
* Built in strain relief
* Low inductance
* High peak reverse power dissipation
* Lead ( Pb) free components
* For use in stabilizing and clipping with high power rating Mechanical Data
* Case : JEDEC DO-214AC(SMA) molded plastic body
* Epoxy: UL 94V-0 rate flam.