| Part Number | SMA4747A |
|---|---|
| Manufacturer | Yangjie Electronic |
| Overview |
SMA47 SERIES （） Zener Diodes
■ Features
●Ptot 1.0W ●Vz 3.3V-100V
.062(1.58) .049(1.25) .187(4.75) .167(4.25)
■
Outline Dimensions and Mark
Mounting Pad Layout
0.065 (1.66) 0.080 (2.04) 0.077(1.96) ..
*Ptot 1.0W *Vz 3.3V-100V .062(1.58) .049(1.25) .187(4.75) .167(4.25) * Outline Dimensions and Mark Mounting Pad Layout 0.065 (1.66) 0.080 (2.04) 0.077(1.96) .012(0.31) .006(0.15) 0.220 (5.58) DO-214AC(SMA) .111(2.83) .094(2.40) * Applications * Stabilizing Voltage .091(2.30) .075(1.90) .056(. |
SMA4747A Datasheet
The SMA4747A is a Zener Diodes.
| Part Number | SMA4747A |
|---|---|
| Description | Surface Mount Zener Diodes |
| Manufacturer | CYStech Electronics |
| Overview |
CYStech Electronics Corp.
Surface Mount Zener Diodes VZ : 3.3 to 330V PD=1W
SMA4728A thru SZ1330A
Spec. No. : C604SA Issued Date : 2016.09.05 Revised Date : Page No. : 1/7
Features
Glass passivate.
* Glass passivated chip * Low leakage * Built in strain relief * Low inductance * High peak reverse power dissipation * Lead ( Pb) free components * For use in stabilizing and clipping with high power rating Mechanical Data * Case : JEDEC DO-214AC(SMA) molded plastic body * Epoxy: UL 94V-0 rate flam. |
| Part Number | SMA4747A |
|---|---|
| Description | Surface Mount Zener Device |
| Manufacturer | Eris Technology |
| Overview | SMA47xxA SERIES Surface Mount Zener Device DO-214AC(SMA) Features ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free com. ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping with high power rating PrimaryCharacteristics VRRM VF TJ max 3.3~330V 1.2V 175°C MechanicMaleDchataenical Date ‧Case: Mol. |
| Part Number | SMA4747A |
|---|---|
| Description | Surface Mount Zener Diodes |
| Manufacturer | ANOVA |
| Overview |
SMA4728A-SZ1330A
VZ: 3.3 to 330 V PD: 1 W
Features
● Glass passivated chip ● Low leakage ● Built-in strain relief ● Low inductance ● High peak reverse power dissipation ● Lead (Pb)-free component ● F.
* Glass passivated chip * Low leakage * Built-in strain relief * Low inductance * High peak reverse power dissipation * Lead (Pb)-free component * For use in stabilizing and clipping circuits with high power rating Mechanical Data * Case: Molded plastic * Epoxy: UL 94V-0 rate flame retardant * Lead:. |