SMB2EZ6.8D5 Datasheet and Specifications PDF

SMB2EZxxD5 SERIES Surface Mount Device 0.086 (2.20) 0.077 (1.95) 0.155 (3.94) 0.130 (3.30) 0.180 (4.57) 0.160 (4.06) 0.012 (0.305) 0.006 (0.152) 0.096 (2.44) 0.084 (2.13) 0.060 (1.52) 0.030 (0.76) 0.

‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case: DO-214AA (SMB) ‧Epoxy: UL 94V-0 rate flame retar.

SMB2EZ3.3D5 THRU SMB2EZ270D5 Glass Passivated Junction Rectifier 3.3V-270V 3.0W FEATURES * Complete Voltage Range 3.3 to 270 Volts * High peak reverse power dissipation * High reliability * Low lea.

* Complete Voltage Range 3.3 to 270 Volts * High peak reverse power dissipation * High reliability * Low leakage current MECHANICAL DATA * Case : SMB Molded plastic * Epoxy : UL94V-O rate flame retardant * Lead : Axial lead solderable per MIL-STD-202, method 208 guaranteed * Polarity : Color band .

MCC TM Micro Commercial Components
  omponents 20736 Marilla Street Chatsworth    !"# $ %    !"# SMB2EZ5.1D5 THRU SMB2EZ75D5 Features • Lead Fr.

* Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates Compliant. See ordering information)
* Glass Passivated Junction
* Excellent Clamping Capability
* Built-in Strain Relief
* Low Inductance
* Halogen free available upon request by adding suffix "-HF" Mechanical Data
* Epoxy meets UL 94 .

2W SURFACE MOUNT ZENER DIODES-6.2 to 330V SMB PACKAGE FEATURES ● Glass passivated chip ● Low leakage ● Built-in strain relief ● Low inductance ● High peak reverse power dissipation ● For use in stabi.

* Glass passivated chip
* Low leakage
* Built-in strain relief
* Low inductance
* High peak reverse power dissipation
* For use in stabilizing and clipping circuits with high power rating
* RoHS product for packing code suffix "G" Halogen free product for packing code suffix "H" .083(2.11) .075(1.9.