SMDJ80 Datasheet
SMDJ80 Datasheet (JFDsemi)
JFDsemi
TVS: SMDJ5.0 thru SMDJ190CA Glass Passivated TVS Features ● For surface mounted applications in order to optimize board space ● Low profile space ● Glass passivated chip ● Low inductance ● Excellent .
* For surface mounted applications in order to optimize board space
* Low profile space
* Glass passivated chip
* Low inductance
* Excellent clamping capability
* Very fast response time
* Typical ID less than 1µA at VWM
* 3000 W peak pulse power capability
with a 10/1000 µs waveform
* Component in .
SMDJ80 Datasheet (Protek Devices)
Protek Devices
05413 Only One Name Means ProTek’Tion™ 3000 Watt TVS Component applications • Power Supply • AC/DC Applications • Telecom SMDJ SERIES DO-214ab package Features • UL Registered • IEC Compatibility 6.
* UL Registered
* IEC Compatibility 61000-4-2 (ESD)
* IEC Compatibility 61000-4-4 (EFT)
* IEC Compatibility 61000-4-5 (Surge)
* Glass Passivated Chip
* 3000 Watts Peak Pulse Power per Line (tp = 10/1000µs)
* Low Leakage Current
* Unidirectional and Bidirectional Configurations
* Excellent Clamping C.
SMDJ80 Datasheet (UN Semiconducctor)
UN Semiconducctor
The SMDJ series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events. Features u For surface mounted appli.
u For surface mounted applications in order to optimize board space u Low leakage u Uni and Bidirectional unit u Glass passivated junction u Low inductance u Excellent clamping capability u 3000W Peak power capability at 10 × 1000µs waveform Repetition rate (duty cycle):0.01% u Fast response time: t.
SMDJ80 Datasheet (MERITEK)
MERITEK
Transient Voltage Suppressors DO-214AB/SMC Package SMDJ Series FEATURE Breakdown Voltage from 5.0 to 440V 3000W peak pulse power capability with a 10/1000μs waveform, repetitive rate (duty cycle.
* Breakdown Voltage from 5.0 to 440V
* 3000W peak pulse power capability with a 10/1000μs waveform,
repetitive rate (duty cycle): 0.01%
* Glass passivated chip
* Excellent clamping capability, fast response time.
* Low incremental surge resistance, Low profile package
* Terminal: Solderable per MIL-.