| Part Number | SUF4001 Datasheet |
|---|---|
| Manufacturer | Semikron Danfoss |
| Overview | SUF 4001 ... SUF 4007 Surface mount diode Ultrafast silicon rectifier diodes /5 2 8 "( 2 8 " 2 8 ") 2 8 "" 2 8 "4 2 8 " 2 8 "3 5 0 $ $ $ $ $ $ $ ; < 6 . !"#$ Mechanical Data % &'$()*+ , - .( / 0 1 $2/&$34 - 5 2 6- - 4 1) . |
SUF4001 Datasheet and Specifications PDF
The SUF4001 is a Surface mount diode.
Key Specifications
| Package | MELF |
|---|---|
| Mount Type | Surface Mount |
| Pins | 2 |
| Max Operating Temp | 175 °C |
| Min Operating Temp | -50 °C |
| Part Number | SUF4001 Datasheet |
|---|---|
| Description | SURFACE MOUNT FAST EFFICIENT RECTIFIERS |
| Manufacturer | HY |
| Overview |
SURFACE MOUNT FAST EFFICIENT RECTIFIERS
FEATURES
● For surface mount applications ● Glass passivated chip junction ● Low leakage current ● High forward surge capability ● Fast switching for high effic.
* For surface mount applications * Glass passivated chip junction * Low leakage current * High forward surge capability * Fast switching for high efficiency * High temperature soldering guaranteed: 260°C/10 seconds at terminals * Lead and body according with RoHS standard SUF4001 thru SUF4007 REVER. |
| Part Number | SUF4001 Datasheet |
|---|---|
| Description | Surface Mount Rectifiers |
| Manufacturer | LGE |
| Overview | SUF4001-SUF4007 Surface Mount Rectifiers REVERSE VOLTAGE: 50 - 1000 V CURRENT: 1.0 A Features Glass passivated device Ideal for surface mouted applications Low leakage current Metallurgically bonded . Glass passivated device Ideal for surface mouted applications Low leakage current Metallurgically bonded construction Mechanical Data Case:JEDEC DO-213AB,molded plastic over passivated chip Polarity: Color band denotes cathode end Weight: 0.0046 ounces, 0.116 gram Mounting position: Any D1 2.6± 0.1. |
| Part Number | SUF4001 Datasheet |
|---|---|
| Description | Surface Mount Rectifiers |
| Manufacturer | Galaxy Microelectronics |
| Overview | Production specification Surface Mount Rectifiers FEATURES z Glass passivated device z Ideal for surface mounted applications z Low leakage current z Metallurgically bonded construction Pb Lead-fre. z Glass passivated device z Ideal for surface mounted applications z Low leakage current z Metallurgically bonded construction Pb Lead-free MECHANICAL DATA z Case: JEDEC DO-213AB,molded plastic over passivated chip z Terminals: Solder plated, solderable per MIL- STD-750,Method 2026 z Polarity: Col. |