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UDZS4.3B Datasheet

The UDZS4.3B is a ZENER DIODES. Download the datasheet PDF and view key features and specifications below.

Part NumberUDZS4.3B
ManufacturerTIPTEK
Overview UDZS2.0B~UDZS36B 200mW SURFACE MOUNT ZENER DIODES CASE：SOD-323 DIMENSIONS IN MILLIMETERS AND (INCHES) FEATURES  PLANAR DIE CONSTRUCTION  200mW POWER DISSIPATION  ZENER VOLTAGES FROM 2.0~36V  ID.
* PLANAR DIE CONSTRUCTION
* 200mW POWER DISSIPATION
* ZENER VOLTAGES FROM 2.0~36V
* IDEALLY SUITED FOR AUTOMATED ASSEMBLY PROCESSES
* BOTH NORMAL AND Pb FREE PRODUCT ARE AVAILABLE: NORMAL: 80~95% Sn , 5~20%Pb Pb FREE: 98.5% Sn ABOVE MECHANICAL DATA
* CASE:SOD-323,MOLDED PLASTIC
* TERMINALS:SOLDERABL.
Part NumberUDZS4.3B
DescriptionZENER VOLTAGE REGULATORS
ManufacturerAiT Components
Overview The UDZS2.0B~ UDZS36B are available in SOD-323 Package FEATURES  Non-wire bonding structure improves  High demand voltage range (3.6V-36V)  Silicon epitaxial planar  RoHS Compliant  Available in.
* Non-wire bonding structure improves
* High demand voltage range (3.6V-36V)
* Silicon epitaxial planar
* RoHS Compliant
* Available in SOD-323 Package ORDERING INFORMATION Package Type SOD-323 Note Part Number UDZS2.0B UDZS2.2B UDZS2.4B UDZS2.7B UDZS3.0B UDZS3.3B UDZS3.6B UDZS3.9B UDZS4.3B UDZS4.
Part NumberUDZS4.3B
DescriptionSMD Zener Diodes
ManufacturerTaitron Components
Overview Power Dissipation Junction Temperature Storage Temperature Range Operating Temperature Range Value 200 125 -55 to 150 -55 to 150 Unit mW °C °C °C Conditions TAITRON COMPONENTS INCORPORATED .
* Non-wire bonding structure improves
* High demand voltage range (2.0V-36V)
* RoHS compliant and Halogen Free SOD-323 Mechanical Data Case: SOD-323, molded plastic Epoxy: Plastic package has UL flammability classification 94V-0 Terminals: Solder plated, solderable per MIL-STD-202, Method 20.
Part NumberUDZS4.3B
DescriptionZener diode
ManufacturerROHM
Overview UDZS3.6B Diodes Zener diode UDZS3.6B zApplications Constant voltage control zExternal dimensions (Unit : mm) 1.25±0.1 0.1±0.1 　　　 0.05 zLand size figure (Unit : mm) 0.9MIN. zFeatures 1) Compact, 2-. 1) Compact, 2-pin mini-mold type for high-density mounting. (UMD2) 2) High reliability. 3) Can be mounted automatically, using chip mounter. 0.3±0.05 0.8MIN. 1.7±0.1 2.5±0.2 UMD2 zStructure 0.7±0.2 　　　 0.1 zConstruction Silicon epitaxial planar ROHM : UMD2 JEDEC : S0D-323 JEITA : SC-90/A dot .