US2JF Datasheet and Specifications PDF

FEATURES The US2AF~US2MF are available in SMAF  Package      For surface mounted applications Low profile package Glass Passivated Chip Junction Easy to pick and place High efficiency A.

The US2AF~US2MF are available in SMAF
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* For surface mounted applications Low profile package Glass Passivated Chip Junction Easy to pick and place High efficiency Available in SMAF Package ORDERING INFORMATION MECHANICAL DATA Package Type Part Number US2AF US2BF US2D.

1 Cathode 2 Anode 12 Top View Marking Code: US2A~US2M Simplified outline SMAF and symbol Maximum Ratings and Electrical characteristics Ratings at 25 °C ambient temperature unless otherwise specified.

* For surface mounted applications
* Low profile package
* Glass Passivated Chip Juntion
* Easy to pick and place
* High efficiency
* Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA
* Case: SMAF
* Terminals: Solderable per MIL-STD-750, Method 2026
* Approx. Weight: 27mg 0.0008.

1 Cathode 2 Anode 12 Top View Marking Code: US2A~US2M Simplified outline SMAF and symbol Maximum Ratings and Electrical characteristics Ratings at 25 °C ambient temperature unless otherwise specified.

* For surface mounted applications
* Low profile package
* Glass Passivated Chip Junction
* Easy to pick and place
* High efficiency
* Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA
* Case: SMAF
* Terminals: Solderable per MIL-STD-750, Method 2026
* Approx. Weight: 27mg 0.000.

US2AF THRU US2MF Surface Mount Ultrafast Recovery Rectifier Reverse Voltage – 50 to 1000 V Forward Current – 2 A Features • Glass Passivated Chip Juntion • For surface mount applications • Low profile.

* Glass Passivated Chip Juntion
* For surface mount applications
* Low profile package
* Easy pick and place SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.3 1.6 Mechanical Data
* Case: SMAF
* Terminals: Solderable per MIL-STD-750, method 2026 0.9 1.1 0.12 0.2 All Dimensions in mm Maximum Ratings and Electri.