ZMM5237B Datasheet and Specifications PDF

The ZMM5237B is a 500mW Surface Mount Zener Diodes.

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Part NumberZMM5237B Datasheet
ManufacturerTaitron Components
Overview Power Dissipation at Ta=25° C Forward Voltage Thermal Resistance Junction to Ambient Junction Temperature Storage Temperature Range Value 500 1.1 0.3 175 -65 to +175 Unit mW V K/mW °C °C Conditions P.
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* Planar Die Construction 500mW Power Dissipation Very Sharp Reverse Characteristic Very High Stability Low Reverse Current Level Standard Zener Voltage Tolerance is ± 5 % Ideally Suited for Automated Assembly Processes RoHS Compliant MiniMelf Mechanical Data Case: Terminals: Polarit.
Part NumberZMM5237B Datasheet
Description500mW SURFACE MOUNT ZENER DIODE
ManufacturerDiodes Incorporated
Overview ZMM5221B - ZMM5267B 500mW SURFACE MOUNT ZENER DIODE Features · 500mW Power Dissipation · Outline Similar to JEDEC DO-213AA · Hemetic Glass Package · Lead Free Finish, RoHS Compliant (Note 3) NOT REC.
* 500mW Power Dissipation
* Outline Similar to JEDEC DO-213AA
* Hemetic Glass Package
* Lead Free Finish, RoHS Compliant (Note 3) NOT RECOMMENDED FOR NEW DESIGN SUGGESTED REPLACEMENT MMSZ52xx C B Mechanical Data
* Case: MiniMELF
* Case Material: Molded Plastic. UL Flammability Classification Rati.
Part NumberZMM5237B Datasheet
Description500mW SURFACE MOUNT ZENER DIODE
ManufacturerWon-Top Electronics
Overview ® WON-TOP ELECTRONICS Features  Planar Die Construction  500mW Power Dissipation  2.4V – 68V Nominal Zener Voltage  5% Standard Vz Tolerance  Ideally Suited for Automated Assembly  For Use in Vo.
* Planar Die Construction
* 500mW Power Dissipation
* 2.4V
* 68V Nominal Zener Voltage
* 5% Standard Vz Tolerance
* Ideally Suited for Automated Assembly
* For Use in Voltage Stabilizer or Reference Mechanical Data
* Case: MiniMELF, Molded Glass
* Terminals: Plated Leads Solderable per MIL-STD-202, .
Part NumberZMM5237B Datasheet
DescriptionZener Diodes
ManufacturerKexin Semiconductor
Overview SMD Type Zener Diodes ZMM5221B - ZMM5267B Diodes Features 500mW Power Dissipation Hemetic Glass Package Absolute Maximum Ratings (Ta = 25 ) Parameter Power dissipation Thermal Resistance, Junction. 500mW Power Dissipation Hemetic Glass Package Absolute Maximum Ratings (Ta = 25 ) Parameter Power dissipation Thermal Resistance, Junction to Ambient Air Forward Voltage @ IF = 200mA Jumction temperature Storage temperature Symbol P R JA VF Tj Tstg Rating 500 300 1.5 175 -65 to +175 Unit mW /W V.