ZMM5253B Datasheet and Specifications PDF

Power Dissipation at Ta=25° C Forward Voltage Thermal Resistance Junction to Ambient Junction Temperature Storage Temperature Range Value 500 1.1 0.3 175 -65 to +175 Unit mW V K/mW °C °C Conditions P.

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* Planar Die Construction 500mW Power Dissipation Very Sharp Reverse Characteristic Very High Stability Low Reverse Current Level Standard Zener Voltage Tolerance is ± 5 % Ideally Suited for Automated Assembly Processes RoHS Compliant MiniMelf Mechanical Data Case: Terminals: Polarit.

FRONTIER ELECTRONICS CO., LTD. ZMM5221B THRU ZMM5257B 500mW MINI MELF ZENER DIODE FEATURES ! LOW COST ! SMALL SIZE ! GLASS SEALED MECHANICAL DATA ! CASE︰MINI MELF GLASS CASE ! TERMINALS：SOLDERABLE .

! LOW COST ! SMALL SIZE ! GLASS SEALED MECHANICAL DATA ! CASE︰MINI MELF GLASS CASE ! TERMINALS：SOLDERABLE PER MIL-STD -202, METHOD 208 ! POLARITY：COLOR BAND DENOTES CATHODE ! MOUNTING POSITION：ANY ! WEIGHT：0.036 GRAMS SOLDERABLE ENDS 1.35±0.05 3.3±0.1 0.3±0.1 CASE：DO-213AA（GL34） DIMENSIONS IN M.

SMD Type Zener Diodes ZMM5221B - ZMM5267B Diodes Features 500mW Power Dissipation Hemetic Glass Package Absolute Maximum Ratings (Ta = 25 ) Parameter Power dissipation Thermal Resistance, Junction.

500mW Power Dissipation Hemetic Glass Package Absolute Maximum Ratings (Ta = 25 ) Parameter Power dissipation Thermal Resistance, Junction to Ambient Air Forward Voltage @ IF = 200mA Jumction temperature Storage temperature Symbol P R JA VF Tj Tstg Rating 500 300 1.5 175 -65 to +175 Unit mW /W V.

SURFACE MOUNT ZENER DIODE ZMM5225B THRU ZMM5267B VOLTAGE RANGE POWER DISSIPATION 3.3 to 100 Volts 500 mWatt FEATURES • Planer die construction • General Purpose, high power device • 500 mW power d.

* Planer die construction
* General Purpose, high power device
* 500 mW power dissipation
* 5% Zener Voltage tolerance
* Also available in DO-35 package as the 1N5225 series MECHANICAL DATA
* Case: Mini-Melf
* Terminals: Solderable per MIL-STD 750, Method 2026
* Polarity: Color band denotes cathode.