DIP40 Datasheet | Specifications & PDF Download
DIP40 Thermal Data
Thermal Data DIP 40 40 leads PACKAGE MATERI.
STMicroelectronics
DIP40 - Thermal Data
Thermal Data DIP 40 40 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C leadframe die attach .
Rating:
1
★
(2 votes)
Since 2006. D4U Semicon. |
Datasheet4U.com
|
Contact Us
|
Privacy Policy
|
Purchase of parts
STMicroelectronics
