STMicroelectronics
DIP40 - Thermal Data
Thermal Data
DIP 40
40 leads
PACKAGE MATERIAL LIST
item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C
leadframe die attach
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Thermal Data DIP 40 40 leads PACKAGE MATERI.
STMicroelectronics
DIP40 Distributor
