Chip Resistor Array Chip Resistor Array Type: EXB.
EXB250-48S2V5-ZRNJ - DC-DC / Industry Standard Isolated Half Brick
EXB250 Series DC-DC CONVERTERS • High efficiency topology, 90% typical at 3.3 V • Industry standard footprint • Wide baseplate temperature, -40 ˚C to .EXB2xxxx - (EXB Series) Chip Resistor Array
m o Chip Resistor Array.c U EXB1 : 0201 Array 4 t Array EXB2 : 0402 e EXB3 : 0603 e Array h EXBN S : 0402 Array EXBV a : 0603 Array t a : 0805 Array E.EXB2 - (EXBx Series) Chip Resistor Array
Chip Resistor Array Chip Resistor Array Type: EXB1 : 0201 Array EXB2 : 0402 Array EXB3 : 0603 Array EXBN : 0402 Array EXBV : 0603 Array EXBS : 0805 A.EXB2xxxx - (EXBx Series) Chip Resistor Array
Chip Resistor Array Chip Resistor Array Type: EXB1 : 0201 Array EXB2 : 0402 Array EXB3 : 0603 Array EXBN : 0402 Array EXBV : 0603 Array EXBS : 0805 A.EXB250-48S05J - DC-DC / Industry Standard Isolated Half Brick
EXB250 Series DC-DC CONVERTERS • High efficiency topology, 90% typical at 3.3 V • Industry standard footprint • Wide baseplate temperature, -40 ˚C to .EXB250-48S12-RJ - DC-DC / Industry Standard Isolated Half Brick
EXB250 Series DC-DC CONVERTERS • High efficiency topology, 90% typical at 3.3 V • Industry standard footprint • Wide baseplate temperature, -40 ˚C to .EXB250-48S1V2-RJ - DC-DC / Industry Standard Isolated Half Brick
EXB250 Series DC-DC CONVERTERS • High efficiency topology, 90% typical at 3.3 V • Industry standard footprint • Wide baseplate temperature, -40 ˚C to .EXB250-48S1V5-09J - DC-DC / Industry Standard Isolated Half Brick
EXB250 Series DC-DC CONVERTERS • High efficiency topology, 90% typical at 3.3 V • Industry standard footprint • Wide baseplate temperature, -40 ˚C to .EXB250-48S1V5-RJ - DC-DC / Industry Standard Isolated Half Brick
EXB250 Series DC-DC CONVERTERS • High efficiency topology, 90% typical at 3.3 V • Industry standard footprint • Wide baseplate temperature, -40 ˚C to .EXB250-48S1V8-RJ - DC-DC / Industry Standard Isolated Half Brick
EXB250 Series DC-DC CONVERTERS • High efficiency topology, 90% typical at 3.3 V • Industry standard footprint • Wide baseplate temperature, -40 ˚C to .EXB250-48S1V8-ZRKJ - DC-DC / Industry Standard Isolated Half Brick
EXB250 Series DC-DC CONVERTERS • High efficiency topology, 90% typical at 3.3 V • Industry standard footprint • Wide baseplate temperature, -40 ˚C to .EXB250-48S2V5-ZRKJ - DC-DC / Industry Standard Isolated Half Brick
EXB250 Series DC-DC CONVERTERS • High efficiency topology, 90% typical at 3.3 V • Industry standard footprint • Wide baseplate temperature, -40 ˚C to .EXB250-48S2V5J - DC-DC / Industry Standard Isolated Half Brick
EXB250 Series DC-DC CONVERTERS • High efficiency topology, 90% typical at 3.3 V • Industry standard footprint • Wide baseplate temperature, -40 ˚C to .EXB250-48S3V3-ZRKJ - DC-DC / Industry Standard Isolated Half Brick
EXB250 Series DC-DC CONVERTERS • High efficiency topology, 90% typical at 3.3 V • Industry standard footprint • Wide baseplate temperature, -40 ˚C to .EXB250-48S3V3-ZRNJ - DC-DC / Industry Standard Isolated Half Brick
EXB250 Series DC-DC CONVERTERS • High efficiency topology, 90% typical at 3.3 V • Industry standard footprint • Wide baseplate temperature, -40 ˚C to .EXB250-48S3V3J - DC-DC / Industry Standard Isolated Half Brick
EXB250 Series DC-DC CONVERTERS • High efficiency topology, 90% typical at 3.3 V • Industry standard footprint • Wide baseplate temperature, -40 ˚C to .EXB28V - Chip Resistor Array
Chip Resistor Array Type: Chip Resistor Array EXB1 : 0201 Array EXB2 : 0402 Array EXB3 : 0603 Array EXBN : 0402 Array EXBV : 0603 Array EXBS : 0805 .EXB2HV - Chip Resistor Array
Chip Resistor Array Type: Chip Resistor Array EXB1 : 0201 Array EXB2 : 0402 Array EXB3 : 0603 Array EXBN : 0402 Array EXBV : 0603 Array EXBS : 0805 .EXB2HV471JV - Chip Resistor Array
Chip Resistor Array Chip Resistor Array Type: EXB1 : 0201 Array EXB2 : 0402 Array EXB3 : 0603 Array EXBN : 0402 Array EXBV : 0603 Array EXBS : 0805 A.EXB250-48S05-RJ - DC-DC / Industry Standard Isolated Half Brick
EXB250 Series DC-DC CONVERTERS • High efficiency topology, 90% typical at 3.3 V • Industry standard footprint • Wide baseplate temperature, -40 ˚C to .