G1D Datasheet | Specifications & PDF Download

ISSUE: 2001.12.18 Industrial & Electrical Components Solid State Relay Part No. HHG1D-1(SSRDA) HHG1D-0(SSR- CHARACTERISTICS Controlling Voltage

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Rev. 0.0, Jan. 2010 KLMxGxxEHx Draft Samsung eMMC moviNAND Product family eMMC Specification compatibility datasheet SAMSUNG ELECTRONICS RESERVES THE

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DATA SHEET SEMICONDUCTOR GPP SURFACE MOUNT RECTIFIER VOLTAGE- 50 to 1000 Volts CURRENT - 1.0 Amperes G1A THRU G1M SMF Unit: inch ( mm ) 0.110(2.80)

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Technical Data Data Sheet N1731, Rev. - G1A-G1M Green Products G1A-G1M 1.0AMP SURFACE MOUNT GLASS RECOVERY RECTIFIER Features: • For surface mounte

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SEMICONDUCTOR TECHNICAL DATA G1A ~ G1M Surface Mount Glass Passivated Standard Rectifier Reverse Voltage 50V ~ 1000V , Forward Current 1.0 Amps Fea

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ISSUE: 2001.12.18 Industrial & Electrical Components Solid State Relay Part No. HHG1D-1(SSRDA) HHG1D-0(SSR- CHARACTERISTICS Controlling Voltage

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VISHAY Standard Sinterglass Diode G1A / B / D / G / J / K / M Vishay Semiconductors Features • High temperature metallurgically bonded constructed r

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G1A THRU G1M  RoHS COMPLIANT   Surface Mount General Purpose Rectifier Features ● Low profile package ● Ideal for automated placement ● Glass pass

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UG1A THRU UG1J Surface Mount Ultra Fast Recovery Rectifier RoHS COMPLIANT Features ● Low profile package ● Ideal for automated placement ● Glass pas

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IV = 750 mcd, VF = 3.2 V Surface Mount LED SECG1D0EC-S Data Sheet Description The SECG1D0EC-S is a surface mount pure green LED. Package Dimensions

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RG1A THRU RG1M GLASS PASSIVATED FAST SWITCHING RECTIFIER Reverse Voltage - 50 to 1000 Volts Forward Current - 1.0 Ampere FEATURES E D DO-204AP 0.034

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IV = 170 mcd, VF = 3.2 V Surface Mount LED SECG1D07C-SD Data Sheet Description The SECG1D07C-SD is a surface mount pure green LED. Features ● Color

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www.DataSheet.co.kr UG1A thru UG1D Vishay General Semiconductor Miniature Ultrafast Plastic Rectifier FEATURES • Glass passivated chip junction • Ul

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www.DataSheet4U.com VISHAY Fast Sinterglass Diode RG1A to RG1M Vishay Semiconductors \ Features • High temperature metallurgically bonded constructi

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