HK1 Datasheet | Specifications & PDF Download

HK 19F SUBMINIATURE DIP RELAY Features ● 2 Form C configuration ● High switching capacity: 125VA/60W ● Bifurcated contacts ● Epoxy sealed for automat

(68 views)

HK 19F SUBMINIATURE DIP RELAY Features ● 2 Form C configuration ● High switching capacity: 125VA/60W ● Bifurcated contacts ● Epoxy sealed for automat

(49 views)

(44 views)

(43 views)

(41 views)

(41 views)

(37 views)

(36 views)

(36 views)

(35 views)

(35 views)

HK 19F SUBMINIATURE DIP RELAY Features ● 2 Form C configuration ● High switching capacity: 125VA/60W ● Bifurcated contacts ● Epoxy sealed for automat

(35 views)

(34 views)

Technische Information / Technical Information IGBT-Module IGBT-modules TDB6HK180N16RR EconoPACK™2 Modul EconoPACK™2 module Vorläufige Daten / Prel

(34 views)

HK14FD MINIATURE INTERMEDIATE POWER RELAY Features ● 5A switching capability ● 5kV dielectric strength (between coil and contacts) ● Plastic sealed a

(31 views)

PHK13N03LT M3D315 TrenchMOS™ logic level FET Rev. 01 — 23 June 2003 Product data 1. Product profile 1.1 Description N-channel enhancement mode field-e

(30 views)

(30 views)

HK 14F MINIATURE HIGH POWER RELAY Features ● 10A switching ● 5kV dielectric strength ● Plastic sealed and dust protected types available ● Environmen

(29 views)

HK 19F SUBMINIATURE DIP RELAY Features ● 2 Form C configuration ● High switching capacity: 125VA/60W ● Bifurcated contacts ● Epoxy sealed for automat

(29 views)

PHK12NQ10T TrenchMOS™ standard level FET M3D315 Rev. 01 — 15 September 2003 Product data 1. Product profile 1.1 Description N-channel enhancement mo

(29 views)