KING CORE Datasheet | Specifications & PDF Download

SPECIFICATION OF WCM SERIES FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI

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SPECIFICATION OF WCM-HS SERIES FEATURES & APPLICATIONS Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0504 and 0805

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SPECIFICATION OF WCM-HS SERIES FEATURES & APPLICATIONS Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0504 and 0805

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SPECIFICATION OF WCM-HS SERIES FEATURES & APPLICATIONS Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0504 and 0805

(9 views)

SPECIFICATION OF WCM SERIES FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI

(8 views)

SPECIFICATION OF WCM SERIES FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI

(8 views)

SPECIFICATION OF WCM-HS SERIES FEATURES & APPLICATIONS Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0504 and 0805

(7 views)

SPECIFICATION OF WCM-HS SERIES FEATURES & APPLICATIONS Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0504 and 0805

(7 views)

SPECIFICATION OF WCM SERIES FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI

(7 views)

SPECIFICATION OF WCM SERIES FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI

(7 views)

SPECIFICATION OF WCM SERIES FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI

(6 views)

SPECIFICATION OF WCM-HS SERIES FEATURES & APPLICATIONS Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0504 and 0805

(6 views)

SPECIFICATION OF WCM SERIES FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI

(6 views)

SPECIFICATION OF WCM SERIES FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI

(6 views)

SPECIFICATION CUSTOMER: ITEM: (1) SHAPE : A6 R 3.5x10 CUST.P/N: K.C.P/N: PN0303DA m/m m/m m/m m/m A 3.5±0.15 B 10±0.3 C D E F G m/m m/m m/m (2)ELEC

(6 views)

SPECIFICATION OF WCM SERIES FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI

(5 views)

SPECIFICATION OF WCM SERIES FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI

(5 views)

SPECIFICATION OF WCM SERIES FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI

(5 views)

SPECIFICATION OF WCM SERIES FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI

(5 views)

SPECIFICATION OF WCM-HS SERIES FEATURES & APPLICATIONS Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0504 and 0805

(4 views)