SOT23-6 (ZETEX)
Package information
Package information - SOT23-6
Surface mounted, 6 pin package Package outline
DIM A A1 A2 b C D E E1 L e e1 L Min. 0.90 0.00 0.90 0.35 0.09 2.70 2.20
(164 views)
PS219A4-ASTX (Mitsubishi)
Dual-In-Line Package Intelligent Power Module
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(98 views)
LN2351 (Natlinear)
Super-Small Package VFM Control Step-up Switching Regulator
LN2351
Super-Small Package VFM Control Step-up Switching Regulator
■ General Description
The LN2351 Series is a CMOS VFM-control step-up switching re
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SM5730UWDW05 (BIVAR)
Surface Mount 5730 package LED
Industry Standard 5730 Package RoHS Compliant Small Package and Footprint X - (C) Cool White, (N) Neutral White, (W) Warm White Wide Viewing
(63 views)
ESP32-PICO-D4 (Espressif)
System-in-Package
ESP32PICOD4
Datasheet
www.espressif.com
Version 2.0 Espressif Systems Copyright © 2022
About This Document
This document provides an introduction
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ME2149 (Microne)
ULTRA-SMALL PACKAGE PWM/PFM SWITCHING CONTROL STEP-UP SWITCHING REGULATOR
ME2149
ULTRA-SMALL PACKAGE PWM/PFM SWITCHING CONTROL STEP-UP SWITCHING REGULATOR
General Description
The ME2149 series is a CMOS step-up switching r
(60 views)
MIP0122SY (Panasonic)
(MIP0xxxSY) Second Generation Three Terminal Package Intelligent Power Device Series
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ACT7006 (Aeroflex Circuit Technology)
ACT7005/7006 Single Package Solution Dual Transceiver/ Protocol/ Subsystem
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CDLL4370A (Compensated Deuices Incorporated)
LEADLESS PACKAGE FOR SURFACE MOUNT
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CDLL4371A (Compensated Deuices Incorporated)
LEADLESS PACKAGE FOR SURFACE MOUNT
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BFT59 (Seme LAB)
Bipolar NPN Device in a Hermetically sealed TO18 Metal Package
(55 views)
DFN-5X6-8L (Alfa-MOS)
Package Dimension
Alfa-MOS
Technology
Package Information ( DFN 5X6-8L )
DFN-5X6-8L
Package Dimension
©2010 Alfa-MOS Technology Corp. 2F, No.80, Sec.1, Cheng Kung Rd.
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CDLL4372A (Compensated Deuices Incorporated)
LEADLESS PACKAGE FOR SURFACE MOUNT
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KTY10 (Siemens Semiconductor Group)
Silicon Spreading Resistance Temperature Sensor in Leaded Plastic Package
Silicon Spreading Resistance Temperature Sensor in Leaded Plastic Package
Features • Temperature dependent Resistor with Positive Temperature Coeffici
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OA47 (ETC)
JEDEC DO-7 PACKAGE
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CE8301 (Chipower)
Small Package PFM Control Step-Up DC/DC Converter
Small Package PFM Control Step-Up DC/DC Converter
CE8301 Series
Small Package PFM Control Step-Up DC/DC Converter
CE8301 Series
INTRODUCTION
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DFN5x6 (Vanguard)
Package Outline
Dual DFN5x6 Package Outline Data
Dual DFN5×6 Package Outline Data
Symbol
A b C D1 D2 E E1 E2 e H K L L1 M α
DIMENSIONS ( unit : mm )
Min
Typ
Max
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CSPRC032 (California Micro Devices Corp)
CHIP SCALE PACKAGE(CSP) EMI FILTER NETWORK
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MMA701 (MCE)
High Linearity Packaged HBT
www.DataSheet4U.com
MMA701-SOT89
High Linearity Packaged HBT
FEATURES
• • • • +45 dBm IP3 at 2.1 GHz +25 dBm Output Power at P-1dB Compression 50% P
(48 views)
PG-LQFP-64-6 (Infineon)
Package Outline
Additional Information, DS3, Nov. 2008
Recommendations for Printed Circuit Board Assembly of Infineon PG-LQFP-64-6, -8 -11/ PG-LQFP-100-2/PG-LQFP-100-
(47 views)
