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www.DataSheet4U.com NIKO-SEM 5A Adjustable Low Dropout Linear Regulator (LDO) L1084 TO-252, 263, 220 GENERAL DESCRIPTION The L1084 is a positive a

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Dual DFN5x6 Package Outline Data Dual DFN5×6 Package Outline Data Symbol A b C D1 D2 E E1 E2 e H K L L1 M α DIMENSIONS ( unit : mm ) Min Typ Max

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DIMENSIONS REF. A A1 A2 b c www.DataSheet4U.com D E E1 e K L 0° 0.45 0.60 0.05 0.8 0.19 0.09 4.9 6.2 4.3 5 6.4 4.4 0.65 8° 0.75 0° 0.018 0.024 1 mm M

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Philips Semiconductors PDF: 2003 Mar 28 Package outline LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm SOT313-2 y X

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IL215A/216A/217A PHOTOTRANSISTOR SMALL OUTLINE SURFACE MOUNT OPTOCOUPLER • FEATURES • High Current Transfer Ratio, IF=1 mA IL215A—20% Minimum IL216A—5

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www.DataSheet4U.com Package information - SC70-5 Surface mounted, 5 pin package Package outline ␣ Dim. A A1 A2 b C D Millimeters Min. 0.80 0.80 0.

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ILD205/206/207/211/213/217 FEATURES • Two Channel Coupler • Industry Standard SOIC-8 Surface Mountable Package • Standard Lead Spacing of .05 • Avail

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48-pin LQFP (7mm×7mm) Outline Dimensions C D 36 37 AB 48 Symbol A B C D E F G H I J K α Symbol A B C D E F G H I J K α 1 Min. — — — — — 0.007 0

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TSSOP and MSOP Small Outline Packages • Wide range of body sizes • 8 to 56 lead counts • Thermally enhanced versions available (TSSOP-ep and MSOP-ep)

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P/PG-LQFP-64-6, -8, -12, -19, -22 Package Outline 0.1±0.05 STAND OFF 1.4 ±0.05 1.6 MAX. 0.15 -+0.0.0065 0° 7° 15 x 0.5 = 7.5 H 0.5 0.2 +0.07 -

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ILD205/206/207/211/213/217 FEATURES • Two Channel Coupler • Industry Standard SOIC-8 Surface Mountable Package • Standard Lead Spacing of .05 • Avail

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FUJITSU SEMICONDUCTOR DATA SHEET SMALL OUTLINE L-LEADED PACKAGE 8 PIN PLASTIC FPT-8P-M01 8-pin plastic SOP Lead pitch Package width × package lengt

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NIKO-SEM 5A Adjustable Low Dropout Linear Regulator (LDO) L1084S5 TO-263 GENERAL DESCRIPTION The L1084 is a positive and low dropout three-terminal

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2003 3 Watt - 28 Volts, Class C Microwave 2000 MHz GENERAL DESCRIPTION The 2003 is a COMMON BASE transistor capable of providing 3 Watts Class C, RF o

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Tech MOS Technology SOP-8 Packaging Outline E H www.DataSheet4U.com e1 e2 D A1 A C L 0.004max. SYMBOLS A A1 C D E H e1 e2 L Millimeters MI

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DIMENSIONS REF. Millimeters Min. A A1 B c D e e1 E H L S 0.89 0 0.3 0.085 2.75 0.85 1.7 1.2 2.1 0.35 Max. 1.4 0.1 0.51 0.18 3.04 1.05 2.1 1.6 2.75 0.6

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06054 Only One Name Means ProTek’Tion™ QFN-16 PACKAGE package outline & pad layout outline dimensions dim A B C D E F G H I NOTEs 0.18 0.35 0.71 0.

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PC 2004-M OUTLINE DIMENSION & BLOCK DIAGRAM 146.0 0.5 3.5 4.75 18.0 1 P2.54 x 17=43.18 18- 1.0 PAD 18- 1.8 139.0 H1 H2 2.5 18 32.25 5.0 55.0 43.0 38

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IL205A/206A/207/208A SMALL OUTLINE SURFACE MOUNT PHOTOTRANSISTOR OPTOCOUPLER FEATURES • High Current Transfer Ratio, IF=10 mA, VCE=5 V IL205A, 40–80%

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D a t a S he et , Rev. 0.91, J u n e 2 00 4 HYS64T32000[G/H]DL–[3.7/5]–A HYS64T64020[G/H]DL–[3.7/5]–A HYS64T128021[G/H]DL–[3.7/5]–A 200-Pin Small Out

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