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Advanced Semiconductor
Advanced Semiconductor

ALN0859 Datasheet Preview

ALN0859 Datasheet

Internally Matched LNA Module

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ALN0859 pdf
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plerowTM ALN0859
Internally Matched LNA Module
Features
· S21 = 38 dB @ 824 MHz
= 37 dB @ 894 MHz
· NF of 0.65 dB over Frequency
· Unconditionally Stable
· Single 5V Supply
· High OIP3 @ Low Current
Description
The plerowTM ALN-series is the compactly designed surface-mount
module for the use of the LNA with or without the following gain blocks in
the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS,
PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communi-
cation terminals, CATV and so on. It has an exceptional performance of
low noise figure, high gain, high OIP3, and low bias current. The stability
factor is always kept more than unity over the application band in order
to ensure its unconditionally stable implementation to the application
system environment. The surface-mount module package including the
completed matching circuit and other components necessary just in case
allows very simple and convenient implementation onto the system
board in mass production level.
Specifications (in Production)
Typ. @ T = 25°C, Vs = 5 V, Freq. = 859 MHz, Zo.sys =50 ohm
Parameter
Unit Specifications
Min Typ Max
Frequency Range
MHz
824
894
Gain
dB 36.5 37.5
Gain Flatness
dB
± 0.5
± 0.7
Noise Figure
dB
0.65 0.7
Output IP3 (1)
dBm 33 34
S11 / S22 (2)
dB
-18 / -14
Output P1dB
dBm 16 17
Switching Time (3)
µsec
-
Supply Current
mA
105 125
Supply Voltage
V
5
Impedance
50
Max. RF Input Power
dBm
C.W 29 ~ 31 (before fail)
Package Type & Size
mm Surface Mount Type, 13Wx13Lx3.8H
Operating temperature is -40°C to +85°C.
1) OIP3 is measured with two tones at an output power of 8 dBm / tone separated by 1 MHz.
2) S11/S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
Outline Drawing (Unit: mm)
2-stage Single Type
More Information
Website: www.asb.co.kr
E-mail: sales@asb.co.kr
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
ASB Inc., 4th Fl. Venture Town
Bldg., 367-17 Goijeong-Dong,
Seo-Gu, Daejon 302-716, Korea
plerow
ALN0859
ASB Inc.
(Top View)
Solder Stencil Area
(Side View)
(Bottom View)
Pin Number
3
8
10
Others
Function
RF In
RF Out
+Vcc
Ground
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
Ø0.4 plated thru holes to ground plane
1/2
(Recommended Footprint)
www.asb.co.kr
November 2008



Advanced Semiconductor
Advanced Semiconductor

ALN0859 Datasheet Preview

ALN0859 Datasheet

Internally Matched LNA Module

No Preview Available !

ALN0859 pdf
www.DataSheet4U.com
Application Circuit
V DC
plerowTM ALN0859
Internally Matched LNA Module
+-
Tantal
Capacitor
IN
C1
ALN
OUT
C2
1) The tantal capacitor is optional and for bypassing the AC noise introduced from the DC supply.
The capacitance value may be determined by customer’s DC supply status.
2) So-called DC blocking capacitors are always necessarily placed at the input and output port
for allowing only the RF signal to pass and blocking the DC component in the signal. The DC
blocking capacitors are included inside the LNA module. Therefore, C1 & C2 capacitors may
not be necessary, but can be added just in case that the customer wants. The value of C1 &
C2 is determined by considering the application frequency.
Recommended Soldering Reflow Process
260°C
20~40 sec
200°C
Ramp-up
(3˚C/sec)
Ramp-down
(6°C/sec)
150°C
60~180 sec
Evaluation Board Layout
+Vcc
IN OUT
Size 25 x 25mm
(for ALN Series – 13x13mm)
2/2
www.asb.co.kr
November 2008


Part Number ALN0859
Description Internally Matched LNA Module
Maker Advanced Semiconductor
Total Page 2 Pages
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