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Cypress Semiconductor Electronic Components Datasheet

CY62177EV30 Datasheet

32-Mbit (2M x 16) Static

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CY62177EV30 pdf
CY62177EV30 MoBL®
32-Mbit (2 M × 16 / 4 M × 8) Static RAM
32-Mbit (2 M × 16 / 4 M × 8) Static RAM
Features
Thin small outline package (TSOP) I configurable as 2 M × 16
or as 4 M x 8 static RAM (SRAM)
Very high speed
55 ns
Wide voltage range
2.2 V to 3.7 V
Ultra low standby power
Typical standby current: 3 A
Maximum standby current: 25 A
Ultra low active power
Typical active current: 4.5 mA at f = 1 MHz
Easy memory expansion with CE1, CE2, and OE Features
Automatic power down when deselected
Complementary Metal Oxide Semiconductor (CMOS) for
optimum speed and power
Available in Pb-free 48-ball TSOP I package
Logic Block Diagram
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
DATA IN DRIVERS
2M × 16
RAM Array
Functional Description
The CY62177EV30 is a high performance CMOS static RAM
organized as 2 M words by 16 bits and 4 M words by 8 bits. This
device features advanced circuit design to provide ultra low
active current. It is ideal for providing More Battery Life
(MoBL®) in portable applications such as cellular telephones.
The device also has an automatic power down feature that
significantly reduces power consumption by 99 percent when
addresses are not toggling. The device can also be put into
standby mode when deselected (CE1 HIGH or CE2 LOW or both
BHE and BLE are HIGH). The input and output pins (I/O0 through
I/O15) are placed in a high impedance state when: deselected
(CE1HIGH or CE2 LOW), outputs are disabled (OE HIGH), both
Byte High Enable and Byte Low Enable are disabled (BHE, BLE
HIGH), or during a write operation (CE1 LOW, CE2 HIGH and WE
LOW).
To write to the device, take Chip Enables (CE1 LOW and CE2
HIGH) and Write Enable (WE) input LOW. If Byte Low Enable
(BLE) is LOW, then data from I/O pins (I/O0 through I/O7), is
written into the location specified on the address pins (A0 through
A20). If Byte High Enable (BHE) is LOW, then data from I/O pins
(I/O8 through I/O15) is written to the location specified on the
address pins (A0 through A20). To read from the device, take
Chip Enables (CE1 LOW and CE2 HIGH) and Output Enable
(OE) LOW while forcing the Write Enable (WE) HIGH. If Byte
Low Enable (BLE) is LOW, then data from the memory location
specified by the address pins appear on I/O0 to I/O7. If Byte High
Enable (BHE) is LOW, then data from memory appears on I/O8
to I/O15. See the Truth Table on page 10 for a complete
description of read and write modes.
Pin #13 of the 48 TSOP I package is an DNU pin that must be
left floating at all times to ensure proper application.
I/O0–I/O7
I/O8–I/O15
COLUMN DECODER
Power-Down
Circuit
BHE
BLE
BYTE
BHE
WE
OE
BLE
CE2
CE1
CE2
CE1
Cypress Semiconductor Corporation • 198 Champion Court
wwwD.DocautamSheenett4NUu.nmebt er: 001-09880 Rev. *H
• San Jose, CA 95134-1709 • 408-943-2600
Revised June 29, 2011


Cypress Semiconductor Electronic Components Datasheet

CY62177EV30 Datasheet

32-Mbit (2M x 16) Static

No Preview Available !

CY62177EV30 pdf
CY62177EV30 MoBL®
Contents
Pin Configuration ............................................................. 3
Product Portfolio .............................................................. 3
Maximum Ratings ............................................................. 4
Operating Range ............................................................... 4
Electrical Characteristics ................................................. 4
Capacitance ...................................................................... 4
Thermal Resistance .......................................................... 5
Data Retention Characteristics ....................................... 5
Switching Characteristics ................................................ 6
Switching Waveforms ...................................................... 7
Truth Table ...................................................................... 10
Ordering Information ...................................................... 11
Ordering Code Definitions ......................................... 11
Package Diagram ............................................................ 12
Acronyms ........................................................................ 13
Document Conventions ................................................. 13
Units of Measure ....................................................... 13
Document History Page ................................................. 14
Sales, Solutions, and Legal Information ...................... 15
Worldwide Sales and Design Support ....................... 15
Products .................................................................... 15
PSoC Solutions ......................................................... 15
Document Number: 001-09880 Rev. *H
Page 2 of 15


Part Number CY62177EV30
Description 32-Mbit (2M x 16) Static
Maker Cypress Semiconductor
Total Page 15 Pages
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